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United States 3D IC and 2.5D IC Packaging Market Report 2018

Published By :

QYResearch

Published Date : Jan 2018

Category :

Semiconductors

No. of Pages : 96 Pages

In this report, the United States 3D IC and 2.5D IC Packaging market is valued at USD XX million in 2016 and is expected to reach USD XX million by the end of 2022, growing at a CAGR of XX% between 2016 and 2022.

Geographically, this report splits the United States market into seven regions:
The West
Southwest
The Middle Atlantic
New England
The South
The Midwest
with sales (volume), revenue (value), market share and growth rate of 3D IC and 2.5D IC Packaging in these regions, from 2012 to 2022 (forecast).

United States 3D IC and 2.5D IC Packaging market competition by top manufacturers/players, with 3D IC and 2.5D IC Packaging sales volume, price, revenue (Million USD) and market share for each manufacturer/player; the top players including
Taiwan Semiconductor
Samsung Electronics
Toshiba Corp
Advanced Semiconductor Engineering
Amkor Technology
...

On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into
3D wafer-level chip-scale packaging
3D TSV
2.5D
On the basis on the end users/applications, this report focuses on the status and outlook for major applications/end users, sales volume, market share and growth rate for each application, including
Logic
Imaging & optoelectronics
Memory
MEMS/sensors
LED
Power

If you have any special requirements, please let us know and we will offer you the report as you want.

Table of Contents

United States 3D IC and 2.5D IC Packaging Market Report 2017
1 3D IC and 2.5D IC Packaging Overview
1.1 Product Overview and Scope of 3D IC and 2.5D IC Packaging
1.2 Classification of 3D IC and 2.5D IC Packaging by Product Category
1.2.1 United States 3D IC and 2.5D IC Packaging Market Size (Sales Volume) Comparison by Type (2012-2022)
1.2.2 United States 3D IC and 2.5D IC Packaging Market Size (Sales Volume) Market Share by Type (Product Category) in 2016
1.2.3 3D wafer-level chip-scale packaging
1.2.4 3D TSV
1.2.5 2.5D
1.3 United States 3D IC and 2.5D IC Packaging Market by Application/End Users
1.3.1 United States 3D IC and 2.5D IC Packaging Market Size (Consumption) and Market Share Comparison by Application (2012-2022)
1.3.2 Logic
1.3.3 Imaging & optoelectronics
1.3.4 Memory
1.3.5 MEMS/sensors
1.3.6 LED
1.3.7 Power
1.4 United States 3D IC and 2.5D IC Packaging Market by Region
1.4.1 United States 3D IC and 2.5D IC Packaging Market Size (Value) Comparison by Region (2012-2022)
1.4.2 The West 3D IC and 2.5D IC Packaging Status and Prospect (2012-2022)
1.4.3 Southwest 3D IC and 2.5D IC Packaging Status and Prospect (2012-2022)
1.4.4 The Middle Atlantic 3D IC and 2.5D IC Packaging Status and Prospect (2012-2022)
1.4.5 New England 3D IC and 2.5D IC Packaging Status and Prospect (2012-2022)
1.4.6 The South 3D IC and 2.5D IC Packaging Status and Prospect (2012-2022)
1.4.7 The Midwest 3D IC and 2.5D IC Packaging Status and Prospect (2012-2022)
1.5 United States Market Size (Value and Volume) of 3D IC and 2.5D IC Packaging (2012-2022)
1.5.1 United States 3D IC and 2.5D IC Packaging Sales and Growth Rate (2012-2022)
1.5.2 United States 3D IC and 2.5D IC Packaging Revenue and Growth Rate (2012-2022)

2 United States 3D IC and 2.5D IC Packaging Market Competition by Players/Suppliers
2.1 United States 3D IC and 2.5D IC Packaging Sales and Market Share of Key Players/Suppliers (2012-2017)
2.2 United States 3D IC and 2.5D IC Packaging Revenue and Share by Players/Suppliers (2012-2017)
2.3 United States 3D IC and 2.5D IC Packaging Average Price by Players/Suppliers (2012-2017)
2.4 United States 3D IC and 2.5D IC Packaging Market Competitive Situation and Trends
2.4.1 United States 3D IC and 2.5D IC Packaging Market Concentration Rate
2.4.2 United States 3D IC and 2.5D IC Packaging Market Share of Top 3 and Top 5 Players/Suppliers
2.4.3 Mergers & Acquisitions, Expansion in United States Market
2.5 United States Players/Suppliers 3D IC and 2.5D IC Packaging Manufacturing Base Distribution, Sales Area, Product Type

3 United States 3D IC and 2.5D IC Packaging Sales (Volume) and Revenue (Value) by Region (2012-2017)
3.1 United States 3D IC and 2.5D IC Packaging Sales and Market Share by Region (2012-2017)
3.2 United States 3D IC and 2.5D IC Packaging Revenue and Market Share by Region (2012-2017)
3.3 United States 3D IC and 2.5D IC Packaging Price by Region (2012-2017)

4 United States 3D IC and 2.5D IC Packaging Sales (Volume) and Revenue (Value) by Type (Product Category) (2012-2017)
4.1 United States 3D IC and 2.5D IC Packaging Sales and Market Share by Type (Product Category) (2012-2017)
4.2 United States 3D IC and 2.5D IC Packaging Revenue and Market Share by Type (2012-2017)
4.3 United States 3D IC and 2.5D IC Packaging Price by Type (2012-2017)
4.4 United States 3D IC and 2.5D IC Packaging Sales Growth Rate by Type (2012-2017)

5 United States 3D IC and 2.5D IC Packaging Sales (Volume) by Application (2012-2017)
5.1 United States 3D IC and 2.5D IC Packaging Sales and Market Share by Application (2012-2017)
5.2 United States 3D IC and 2.5D IC Packaging Sales Growth Rate by Application (2012-2017)
5.3 Market Drivers and Opportunities

6 United States 3D IC and 2.5D IC Packaging Players/Suppliers Profiles and Sales Data
6.1 Taiwan Semiconductor
6.1.1 Company Basic Information, Manufacturing Base and Competitors
6.1.2 3D IC and 2.5D IC Packaging Product Category, Application and Specification
6.1.2.1 Product A
6.1.2.2 Product B
6.1.3 Taiwan Semiconductor 3D IC and 2.5D IC Packaging Sales, Revenue, Price and Gross Margin (2012-2017)
6.1.4 Main Business/Business Overview
6.2 Samsung Electronics
6.2.2 3D IC and 2.5D IC Packaging Product Category, Application and Specification
6.2.2.1 Product A
6.2.2.2 Product B
6.2.3 Samsung Electronics 3D IC and 2.5D IC Packaging Sales, Revenue, Price and Gross Margin (2012-2017)
6.2.4 Main Business/Business Overview
6.3 Toshiba Corp
6.3.2 3D IC and 2.5D IC Packaging Product Category, Application and Specification
6.3.2.1 Product A
6.3.2.2 Product B
6.3.3 Toshiba Corp 3D IC and 2.5D IC Packaging Sales, Revenue, Price and Gross Margin (2012-2017)
6.3.4 Main Business/Business Overview
6.4 Advanced Semiconductor Engineering
6.4.2 3D IC and 2.5D IC Packaging Product Category, Application and Specification
6.4.2.1 Product A
6.4.2.2 Product B
6.4.3 Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Sales, Revenue, Price and Gross Margin (2012-2017)
6.4.4 Main Business/Business Overview
6.5 Amkor Technology
6.5.2 3D IC and 2.5D IC Packaging Product Category, Application and Specification
6.5.2.1 Product A
6.5.2.2 Product B
6.5.3 Amkor Technology 3D IC and 2.5D IC Packaging Sales, Revenue, Price and Gross Margin (2012-2017)
6.5.4 Main Business/Business Overview
...

7 3D IC and 2.5D IC Packaging Manufacturing Cost Analysis
7.1 3D IC and 2.5D IC Packaging Key Raw Materials Analysis
7.1.1 Key Raw Materials
7.1.2 Price Trend of Key Raw Materials
7.1.3 Key Suppliers of Raw Materials
7.1.4 Market Concentration Rate of Raw Materials
7.2 Proportion of Manufacturing Cost Structure
7.2.1 Raw Materials
7.2.2 Labor Cost
7.2.3 Manufacturing Expenses
7.3 Manufacturing Process Analysis of 3D IC and 2.5D IC Packaging

8 Industrial Chain, Sourcing Strategy and Downstream Buyers
8.1 3D IC and 2.5D IC Packaging Industrial Chain Analysis
8.2 Upstream Raw Materials Sourcing
8.3 Raw Materials Sources of 3D IC and 2.5D IC Packaging Major Manufacturers in 2016
8.4 Downstream Buyers

9 Marketing Strategy Analysis, Distributors/Traders
9.1 Marketing Channel
9.1.1 Direct Marketing
9.1.2 Indirect Marketing
9.1.3 Marketing Channel Development Trend
9.2 Market Positioning
9.2.1 Pricing Strategy
9.2.2 Brand Strategy
9.2.3 Target Client
9.3 Distributors/Traders List

10 Market Effect Factors Analysis
10.1 Technology Progress/Risk
10.1.1 Substitutes Threat
10.1.2 Technology Progress in Related Industry
10.2 Consumer Needs/Customer Preference Change
10.3 Economic/Political Environmental Change

11 United States 3D IC and 2.5D IC Packaging Market Size (Value and Volume) Forecast (2017-2022)
11.1 United States 3D IC and 2.5D IC Packaging Sales Volume, Revenue Forecast (2017-2022)
11.2 United States 3D IC and 2.5D IC Packaging Sales Volume Forecast by Type (2017-2022)
11.3 United States 3D IC and 2.5D IC Packaging Sales Volume Forecast by Application (2017-2022)
11.4 United States 3D IC and 2.5D IC Packaging Sales Volume Forecast by Region (2017-2022)

12 Research Findings and Conclusion

13 Appendix
13.1 Methodology/Research Approach
13.1.1 Research Programs/Design
13.1.2 Market Size Estimation
13.1.3 Market Breakdown and Data Triangulation
13.2 Data Source
13.2.1 Secondary Sources
13.2.2 Primary Sources
13.3 Disclaimer


List of Table

List of Tables and Figures

Figure Product Picture of 3D IC and 2.5D IC Packaging
Figure United States 3D IC and 2.5D IC Packaging Market Size (Units) by Type (2012-2022)
Figure United States 3D IC and 2.5D IC Packaging Sales Volume Market Share by Type (Product Category) in 2016
Figure 3D wafer-level chip-scale packaging Product Picture
Figure 3D TSV Product Picture
Figure 2.5D Product Picture
Figure United States 3D IC and 2.5D IC Packaging Market Size (Units) by Application (2012-2022)
Figure United States Sales Market Share of 3D IC and 2.5D IC Packaging by Application in 2016
Figure Logic Examples
Table Key Downstream Customer in Logic
Figure Imaging & optoelectronics Examples
Table Key Downstream Customer in Imaging & optoelectronics
Figure Memory Examples
Table Key Downstream Customer in Memory
Figure MEMS/sensors Examples
Table Key Downstream Customer in MEMS/sensors
Figure LED Examples
Table Key Downstream Customer in LED
Figure Power Examples
Table Key Downstream Customer in Power
Figure United States 3D IC and 2.5D IC Packaging Market Size (Million USD) by Region (2012-2022)
Figure The West 3D IC and 2.5D IC Packaging Revenue (Million USD) and Growth Rate (2012-2022)
Figure Southwest 3D IC and 2.5D IC Packaging Revenue (Million USD) and Growth Rate (2012-2022)
Figure The Middle Atlantic 3D IC and 2.5D IC Packaging Revenue (Million USD) and Growth Rate (2012-2022)
Figure New England 3D IC and 2.5D IC Packaging Revenue (Million USD) and Growth Rate (2012-2022)
Figure The South of US 3D IC and 2.5D IC Packaging Revenue (Million USD) and Growth Rate (2012-2022)
Figure The Midwest 3D IC and 2.5D IC Packaging Revenue (Million USD) and Growth Rate (2012-2022)
Figure United States 3D IC and 2.5D IC Packaging Sales (Units) and Growth Rate (2012-2022)
Figure United States 3D IC and 2.5D IC Packaging Revenue (Million USD) and Growth Rate (2012-2022)
Figure United States 3D IC and 2.5D IC Packaging Market Major Players Product Sales Volume (Units) (2012-2017)
Table United States 3D IC and 2.5D IC Packaging Sales (Units) of Key Players/Suppliers (2012-2017)
Table United States 3D IC and 2.5D IC Packaging Sales Share by Players/Suppliers (2012-2017)
Figure 2016 United States 3D IC and 2.5D IC Packaging Sales Share by Players/Suppliers
Figure 2017 United States 3D IC and 2.5D IC Packaging Sales Share by Players/Suppliers
Figure United States 3D IC and 2.5D IC Packaging Market Major Players Product Revenue (Million USD) (2012-2017)
Table United States 3D IC and 2.5D IC Packaging Revenue (Million USD) by Players/Suppliers (2012-2017)
Table United States 3D IC and 2.5D IC Packaging Revenue Share by Players/Suppliers (2012-2017)
Figure 2016 United States 3D IC and 2.5D IC Packaging Revenue Share by Players/Suppliers
Figure 2017 United States 3D IC and 2.5D IC Packaging Revenue Share by Players/Suppliers
Table United States Market 3D IC and 2.5D IC Packaging Average Price (K USD/Unit) of Key Players/Suppliers (2012-2017)
Figure United States Market 3D IC and 2.5D IC Packaging Average Price (K USD/Unit) of Key Players/Suppliers in 2016
Figure United States 3D IC and 2.5D IC Packaging Market Share of Top 3 Players/Suppliers
Figure United States 3D IC and 2.5D IC Packaging Market Share of Top 5 Players/Suppliers
Table United States Players/Suppliers 3D IC and 2.5D IC Packaging Manufacturing Base Distribution and Sales Area
Table United States Players/Suppliers 3D IC and 2.5D IC Packaging Product Category
Table United States 3D IC and 2.5D IC Packaging Sales (Units) by Region (2012-2017)
Table United States 3D IC and 2.5D IC Packaging Sales Share by Region (2012-2017)
Figure United States 3D IC and 2.5D IC Packaging Sales Share by Region (2012-2017)
Figure United States 3D IC and 2.5D IC Packaging Sales Market Share by Region in 2016
Table United States 3D IC and 2.5D IC Packaging Revenue (Million USD) and Market Share by Region (2012-2017)
Table United States 3D IC and 2.5D IC Packaging Revenue Share by Region (2012-2017)
Figure United States 3D IC and 2.5D IC Packaging Revenue Market Share by Region (2012-2017)
Figure United States 3D IC and 2.5D IC Packaging Revenue Market Share by Region in 2016
Table United States 3D IC and 2.5D IC Packaging Price (K USD/Unit) by Region (2012-2017)
Table United States 3D IC and 2.5D IC Packaging Sales (Units) by Type (2012-2017)
Table United States 3D IC and 2.5D IC Packaging Sales Share by Type (2012-2017)
Figure United States 3D IC and 2.5D IC Packaging Sales Share by Type (2012-2017)
Figure United States 3D IC and 2.5D IC Packaging Sales Market Share by Type in 2016
Table United States 3D IC and 2.5D IC Packaging Revenue (Million USD) and Market Share by Type (2012-2017)
Table United States 3D IC and 2.5D IC Packaging Revenue Share by Type (2012-2017)
Figure Revenue Market Share of 3D IC and 2.5D IC Packaging by Type (2012-2017)
Figure Revenue Market Share of 3D IC and 2.5D IC Packaging by Type in 2016
Table United States 3D IC and 2.5D IC Packaging Price (K USD/Unit) by Types (2012-2017)
Figure United States 3D IC and 2.5D IC Packaging Sales Growth Rate by Type (2012-2017)
Table United States 3D IC and 2.5D IC Packaging Sales (Units) by Application (2012-2017)
Table United States 3D IC and 2.5D IC Packaging Sales Market Share by Application (2012-2017)
Figure United States 3D IC and 2.5D IC Packaging Sales Market Share by Application (2012-2017)
Figure United States 3D IC and 2.5D IC Packaging Sales Market Share by Application in 2016
Table United States 3D IC and 2.5D IC Packaging Sales Growth Rate by Application (2012-2017)
Figure United States 3D IC and 2.5D IC Packaging Sales Growth Rate by Application (2012-2017)
Table Taiwan Semiconductor Basic Information List
Table Taiwan Semiconductor 3D IC and 2.5D IC Packaging Sales (Units), Revenue (Million USD), Price (K USD/Unit) and Gross Margin (2012-2017)
Figure Taiwan Semiconductor 3D IC and 2.5D IC Packaging Sales Growth Rate (2012-2017)
Figure Taiwan Semiconductor 3D IC and 2.5D IC Packaging Sales Market Share in United States (2012-2017)
Figure Taiwan Semiconductor 3D IC and 2.5D IC Packaging Revenue Market Share in United States (2012-2017)
Table Samsung Electronics Basic Information List
Table Samsung Electronics 3D IC and 2.5D IC Packaging Sales (Units), Revenue (Million USD), Price (K USD/Unit) and Gross Margin (2012-2017)
Figure Samsung Electronics 3D IC and 2.5D IC Packaging Sales Growth Rate (2012-2017)
Figure Samsung Electronics 3D IC and 2.5D IC Packaging Sales Market Share in United States (2012-2017)
Figure Samsung Electronics 3D IC and 2.5D IC Packaging Revenue Market Share in United States (2012-2017)
Table Toshiba Corp Basic Information List
Table Toshiba Corp 3D IC and 2.5D IC Packaging Sales (Units), Revenue (Million USD), Price (K USD/Unit) and Gross Margin (2012-2017)
Figure Toshiba Corp 3D IC and 2.5D IC Packaging Sales Growth Rate (2012-2017)
Figure Toshiba Corp 3D IC and 2.5D IC Packaging Sales Market Share in United States (2012-2017)
Figure Toshiba Corp 3D IC and 2.5D IC Packaging Revenue Market Share in United States (2012-2017)
Table Advanced Semiconductor Engineering Basic Information List
Table Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Sales (Units), Revenue (Million USD), Price (K USD/Unit) and Gross Margin (2012-2017)
Figure Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Sales Growth Rate (2012-2017)
Figure Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Sales Market Share in United States (2012-2017)
Figure Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Revenue Market Share in United States (2012-2017)
Table Amkor Technology Basic Information List
Table Amkor Technology 3D IC and 2.5D IC Packaging Sales (Units), Revenue (Million USD), Price (K USD/Unit) and Gross Margin (2012-2017)
Figure Amkor Technology 3D IC and 2.5D IC Packaging Sales Growth Rate (2012-2017)
Figure Amkor Technology 3D IC and 2.5D IC Packaging Sales Market Share in United States (2012-2017)
Figure Amkor Technology 3D IC and 2.5D IC Packaging Revenue Market Share in United States (2012-2017)
Table Production Base and Market Concentration Rate of Raw Material
Figure Price Trend of Key Raw Materials
Table Key Suppliers of Raw Materials
Figure Manufacturing Cost Structure of 3D IC and 2.5D IC Packaging
Figure Manufacturing Process Analysis of 3D IC and 2.5D IC Packaging
Figure 3D IC and 2.5D IC Packaging Industrial Chain Analysis
Table Raw Materials Sources of 3D IC and 2.5D IC Packaging Major Players/Suppliers in 2016
Table Major Buyers of 3D IC and 2.5D IC Packaging
Table Distributors/Traders List
Figure United States 3D IC and 2.5D IC Packaging Sales Volume (Units) and Growth Rate Forecast (2017-2022)
Figure United States 3D IC and 2.5D IC Packaging Revenue (Million USD) and Growth Rate Forecast (2017-2022)
Figure United States 3D IC and 2.5D IC Packaging Price (K USD/Unit) Trend Forecast (2017-2022)
Table United States 3D IC and 2.5D IC Packaging Sales Volume (Units) Forecast by Type (2017-2022)
Figure United States 3D IC and 2.5D IC Packaging Sales Volume (Units) Forecast by Type (2017-2022)
Figure United States 3D IC and 2.5D IC Packaging Sales Volume (Units) Forecast by Type in 2022
Table United States 3D IC and 2.5D IC Packaging Sales Volume (Units) Forecast by Application (2017-2022)
Figure United States 3D IC and 2.5D IC Packaging Sales Volume (Units) Forecast by Application (2017-2022)
Figure United States 3D IC and 2.5D IC Packaging Sales Volume (Units) Forecast by Application in 2022
Table United States 3D IC and 2.5D IC Packaging Sales Volume (Units) Forecast by Region (2017-2022)
Table United States 3D IC and 2.5D IC Packaging Sales Volume Share Forecast by Region (2017-2022)
Figure United States 3D IC and 2.5D IC Packaging Sales Volume Share Forecast by Region (2017-2022)
Figure United States 3D IC and 2.5D IC Packaging Sales Volume Share Forecast by Region in 2022
Table Research Programs/Design for This Report
Figure Bottom-up and Top-down Approaches for This Report
Figure Data Triangulation
Table Key Data Information from Secondary Sources
Table Key Data Information from Primary Sources

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