Thermal Conductive Adhesives Market - Global Industry Analysis, Size, Share, Growth, Trends and Forecast 2017 - 2026

Thermal Conductive Adhesives Market - Global Industry Analysis, Size, Share, Growth, Trends and Forecast 2017 - 2026

  • Transparency Market Research
  • Ongoing
  • Adhesive

Report Description


Thermal conductive adhesives is a smooth, dark grey paste which is hard, durable and extremely Thermal conductive. Thermal conductive inks have extreme insulating properties. It is viscous in nature since it is highly filled with Thermal conductive ceramic powders. This conductive ceramic powders helps to provide maximum thermal conductivity for electronic appliances. This conductive adhesive easily bonds with metals, ceramics, glass and most plastics used in electronic assemblies. Thermal conductive adhesives are generally designed to provide an efficient heat transfer path between heat generating components, heat sinkers or other cooling devices. The thermal conductive adhesive tapes consist of a carrier which is highly loaded with Thermal conductive fillers coated on single side or both the side with a high temperature resistance.

Thermal conductive adhesives are used in many electronic application due to significant heat generation by modern electronics components. Thermal conductive adhesives have outstanding thermal stability, chemical resistance and high temperature properties. Many Thermal conductive adhesives manufacturers has one-part and two-part epoxy systems, as well as silicone and polyimide systems.

Based on type the Thermal conductive adhesive is segmented as silicones, epoxies, polyurethanes and acrylics and others. Excessive heat in electrical appliances can cause leads to improper functionality of the device. Many companies such as Dow Corning provides Thermal conductive silicone adhesives. This silicone adhesives helps in providing the solution for the most sensitive circuits and components. Thermal conductive silicones adhesives makes sure that the  components remain functional even when the appliances get hot. Modern power semiconductor devices and electronic control units have similar trend of miniaturization. This leads to have higher operating temperatures. Thermal conductive adhesives plays an important role this process. On the one hand, thermal conductive silicones adhesives transfer the device’s heat to the heat sink. On the other, they create a firm yet flexible mechanical bond that doesn’t require further fixing. This reduces the manufacturing costs of electrical appliances. Silicones-based thermal adhesives also plays and important role to   remain virtually wear-free even under permanent thermal stress. Thermal conductive epoxy adhesives offer superior heat dissipation for a wide range of electronic application. The Thermal conductive epoxy adhesive has a high adhesive strength, good surface wet out, low viscocity for potting applications and good gap filling in electronic appliances. Thermal conductive epoxy adhesives are majorly used in for bonding, potting and encapsulation applications in a wide variety of industries. Some specific applications include heat sinking bonding, potting, encapsulating sensors, etc. Thermal conductive polyurethane adhesive is used for advanced electronic assembly. It is a self-leveling, injectable compound which is especially suitable for electronic bonding and potting.

Based on application thermal conductive adhesives market is segmented into battery thermal, heat sink, IC packaging heat conduction, LED lighting thermal, and thermal material potting. Thermal conductive adhesives are often used to dissipate heat from power electronics. It is generally used to bond heat sinks. Thermal conductive adhesives are also used as encapsulation compound for temperature sensors for enclosures or reactors. Adhesives with thermal conductivity are synthetic resins augmented with metallic or inorganic filler materials. To achieve thermal conductivity and electrical isolation at the same time, adhesives augmented with ceramic or mineral-based fillers are used in this process.

Based on geography, the global thermal conductive adhesives can be classified into Asia Pacific, Europe, North America, Latin America, and Middle East and Africa. North America and Europe are the major markets for thermal conductive adhesive market, led by the upturn in growth of electronic industry. The thermal conductive adhesive companies in Asia-Pacific and Latin America is investing more in research and development, which have led to demand for thermal conductive adhesive in Asia-Pacific and Latin America market.    

Major players operating in the global water disinfection chemicals market are Dow Corning, Wacker Chemie AG, 3M, SEPA EUROPE GmbH, Panacol-Elosol GmbH and others. These companies hold a significant share of the market. Thus, the thermal conductive adhesive market experiences intense competition.

The report offers a comprehensive evaluation of the market. It does so via in-depth qualitative insights, historical data, and verifiable projections about market size. The projections featured in the report have been derived using proven research methodologies and assumptions. By doing so, the research report serves as a repository of analysis and information for every facet of the market, including but not limited to: Regional markets, technology, types, and applications.

The study is a source of reliable data on:

  • Market segments and sub-segments
  • Market trends and dynamics
  • Supply and demand
  • Market size
  • Current trends/opportunities/challenges
  • Competitive landscape
  • Technological breakthroughs
  • Value chain and stakeholder analysis

The regional analysis covers:

  • North America (U.S. and Canada)
  • Latin America (Mexico, Brazil, Peru, Chile, and others)
  • Western Europe (Germany, U.K., France, Spain, Italy, Nordic countries, Belgium, Netherlands, and Luxembourg)
  • Eastern Europe (Poland and Russia)
  • Asia Pacific (China, India, Japan, ASEAN, Australia, and New Zealand)
  • Middle East and Africa (GCC, Southern Africa, and North Africa)

The report has been compiled through extensive primary research (through interviews, surveys, and observations of seasoned analysts) and secondary research (which entails reputable paid sources, trade journals, and industry body databases). The report also features a complete qualitative and quantitative assessment by analyzing data gathered from industry analysts and market participants across key points in the industry’s value chain.

A separate analysis of prevailing trends in the parent market, macro- and micro-economic indicators, and regulations and mandates is included under the purview of the study. By doing so, the report projects the attractiveness of each major segment over the forecast period.

Highlights of the report:

  • A complete backdrop analysis, which includes an assessment of the parent market
  • Important changes in market dynamics
  • Market segmentation up to the second or third level
  • Historical, current, and projected size of the market from the standpoint of both value and volume
  • Reporting and evaluation of recent industry developments
  • Market shares and strategies of key players
  • Emerging niche segments and regional markets
  • An objective assessment of the trajectory of the market
  • Recommendations to companies for strengthening their foothold in the market   

Note: Although care has been taken to maintain the highest levels of accuracy in TMR’s reports, recent market/vendor-specific changes may take time to reflect in the analysis. 

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