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Taiwanese IC Packaging & Testing Industry, 3Q 2018

Published By :

Market Intelligence & Consulting Institute

Published Date : Oct 2018

Category :

Semiconductors

No. of Pages : 15 Pages

The report finds that shipment value of the Taiwanese IC packaging and testing industry arrived over USD 3.9 billion in the second quarter of 2018, up both year-on-year and sequentially. The growth is mainly attributed to the strong shipments of memory ICs and the better than expected shipments for smartphones. The industry is forecast to have enjoyed both year-on-year and sequential growth in the third quarter, traditionally the peak season. While the demand for smartphones is likely to sustain, HPC (High Performance Computing) and AI applications are to become major growth drivers to push up high-end wafer-level packaging demand and thus the industry is anticipated to have about 8% year-on-year growth this year.  

Table of Contents

Taiwanese IC Packaging and Testing Industry Shipment Value, 1Q 2016 - 4Q 2018 
Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 1Q 2016 - 4Q 2018 
Taiwanese IC Packaging Industry Shipment Value, 1Q 2016 - 4Q 2018 
Taiwanese IC Testing Industry Shipment Value, 1Q 2016 - 4Q 2018 
Taiwanese IC Packaging Industry Shipment Value Rankings, 1Q 2016 - 2Q 2018 
Taiwanese IC Packaging Industry Shipment Value by Vendors' Tier, 1Q 2016 - 2Q 2018 
Taiwanese IC Testing Industry Shipment Value Rankings, 1Q 2016 - 2Q 2018 
Taiwanese IC Testing Industry Shipment Value by Vendors' Tier, 1Q 2016 - 2Q 2018 
Taiwanese IC Packaging Industry Shipment Value by Customers' Origin, 1Q 2016 - 2Q 2018 
Taiwanese IC Packaging Industry Shipment Value Share by Customers' Origin, 1Q 2016 - 2Q 2018 
Taiwanese IC Testing Industry Shipment Value by Customers' Origin, 1Q 2016 - 2Q 2018 
Taiwanese IC Testing Industry Shipment Value Share by Customers' Origin, 1Q 2016 - 2Q 2018 
Exchange Rate, 1Q 2016 - 2Q 2018 
Research Scope & Definitions

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