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Published on : Jan 21, 2020

ResearchMoz.us has announced the addition of a report, titled “Global Thermal Interface Pads and Material Market Insights, Forecast to 2025”. The study takes a critical scrutiny of the level of competition in the market, offers insights into key trends and opportunities across segments, and analyzes recent growth dynamic. The report takes an incisive look at the outlook of different product segments and evaluates their scope in various applications. Key applications include power supply units, telecom equipment, and consumer electronics. Further, the study takes a closer look at imminent risks involved and entry barriers to new players in emerging markets such as the Middle East and Africa, and Asia Pacific. 

The drive for thermal interface pads and materials stems from the need for heat dissipation mechanism in a variety of electronics. They are popularly used in transferring heat energy electronic components to heat sinks in a range of electronic applications to limit the consumption of energy. The growing uptake of thermal management products in computer and telecom equipment and LED lighting industry is reinforcing the prospects of the thermal interface pads and materials market. Proliferating demands for low-powered consumer devices is also boosting the market. Growing consumer demands for energy-efficient devices has spurred the demands for such pads and materials.

These materials have increasingly been adopted in devices that consume less power and hence need better heat management for their optimal operations. Over the past few years, the demands for auto dispensable thermal interface materials seem to gather momentum in key regions. This has expanded lucrative avenue in the thermal interface pads and materials market. Manufacturers are increasingly focused on improving the performance of these materials by giving attention to aspects that define the conformability.

The growing number of high heat generation components, especially in industrial applications in the thermal interface pads and materials market is bolstering the demand. This is large part of the wide adoption of phase-change materials. The trend is especially noticeable in computer hardware application. Material advances have led to the advent to the advent of thermal gap filler. The need for of surface topography is also propelling new applications. 

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Sizable parts of the global revenues are expected to come from LED devices. However, their high cost is a dampener to the uptake. Moreover, manufacturers are trying to achieve better surface stability of thermal interface pads and materials. Nevertheless, manufacturers are focusing on surface topography to circumvent this problem. Growing adoption of automated dispensing equipment has strengthened the prospects of the thermal interface pads and materials market in recent years. The automation reduces assembly time as well as the cost.

On the regional front, emerging economies have in recent times have been offering abundant opportunities. This is on account of the growing adoption in making energy-efficient consumer devices. Advances in manufacturing technologies have enabled the production of thermal interface pads and materials imparting an increased freedom of handling. Further efforts are pinned on developing versatile pads that can fit several applications in end-use industries. 

Some of the key players in the thermal interface pads and materials market are Laird Technologies Laird Technologies, GrafTech International Holdings, Fujipoly, Henkel, 3M, DOW Corning, The Bergquist Company, and Honeywell International.