866-997-4948(US-Canada Toll Free)

Plastics in Electronics Components: Technologies and Global Markets

Published By :

BCC Research

Published Date : Sep 2017

Category :

Diseases & Conditions

No. of Pages : 177 Pages


The global electronics components market reached nearly 3.9 billion pounds in 2016. This market is estimated to reach nearly 6.1 billion pounds in 2022 from 4.2 billion pounds in 2017 at a compound annual growth rate (CAGR) of 7.7% for 2017-2022.
Thermoplastics market is expected to grow from 3.0 billion pounds in 2017 to 4.6 billion pounds in 2022 at a CAGR of 8.6% from 2017 through 2022.
Thermoset market is expected to grow from nearly 1.2 billion pounds in 2017 to 1.5 billion poundsin 2022 at a CAGR of 5.3% from 2017 through 2022.
Table of Contents Table of Contents Table of Contents Table of Contents Table of Contents Table of Contents
Chapter 1: Introduction ......................................................................................... 1
Study Goals and Objectives........................................................................................................................... 1
Reasons for Doing This Study ........................................................................................................................ 1
Scope of Report ............................................................................................................................................. 1
Information Sources ...................................................................................................................................... 2
Methodology ................................................................................................................................................. 2
Geographic Breakdown ................................................................................................................................. 2
Analyst's Credentials ..................................................................................................................................... 5
Related BCC Research Reports...................................................................................................................... 5
Chapter 2: Summary and Highlights ....................................................................... 7
Chapter 3: Market and Technology Background ................................................. 10
Overview ..................................................................................................................................................... 10
Snapshot of the Electronics Device Market ................................................................................................ 10
Computers ................................................................................................................................................... 11
Overview ................................................................................................................................................. 11
Desktops .................................................................................................................................................. 11
Electronics Displays ..................................................................................................................................... 12
Background .............................................................................................................................................. 12
Printers ........................................................................................................................................................ 12
Overview ................................................................................................................................................. 12
Inkjet Printers .......................................................................................................................................... 12
Monochrome Laser Printers .................................................................................................................... 12
Color Laser Printers ................................................................................................................................. 13
Manufacturers ......................................................................................................................................... 13
All-in-One Machines ................................................................................................................................ 13
Phones ......................................................................................................................................................... 13
Corded ..................................................................................................................................................... 13
Cordless ................................................................................................................................................... 13
Fax Machines .............................................................................................................................................. 13
Scanners ...................................................................................................................................................... 14
Mobile Electronics Devices ......................................................................................................................... 14
Phones ..................................................................................................................................................... 14
Laptops/Notebooks/Netbooks ................................................................................................................ 14
Tablets ..................................................................................................................................................... 15
E-Readers ................................................................................................................................................. 15
Portable Music Players ............................................................................................................................ 15
Automotive Market..................................................................................................................................... 16
Overview ................................................................................................................................................. 16
Electric Cars ............................................................................................................................................. 16
CAFE Issues .............................................................................................................................................. 16
Overview of Electronics Components in Automotive Products .............................................................. 17
Material Usage ........................................................................................................................................ 18
Connectors .............................................................................................................................................. 18
Sensors .................................................................................................................................................... 19
Flexible Circuitry in Automotive Applications ......................................................................................... 20
Chapter 4: Market Breakdown by Technology Type ............................................ 22
Overview ..................................................................................................................................................... 22
Types of Polymers ....................................................................................................................................... 22
Thermoplastics ............................................................................................................................................ 23
Standard Nylons ...................................................................................................................................... 23
Thermoplastic Polymers .......................................................................................................................... 29
Polyphenylene Sulfide ............................................................................................................................. 34
Polyimides ............................................................................................................................................... 38
Polycarbonates ........................................................................................................................................ 41
Polyphthalamides and Other High-Temperature Nylons ........................................................................ 45
Liquid Crystal Polymers ........................................................................................................................... 48
Sulfone Polymers ..................................................................................................................................... 51
Alloys/Blends ........................................................................................................................................... 53
Fluoropolymers ....................................................................................................................................... 55
Polyaryletherketones .............................................................................................................................. 57
Cyclic Olefin Copolymers ......................................................................................................................... 59
Thermoplastic Market Estimates and Forecasts Summary ..................................................................... 60
Thermoset Polymers ................................................................................................................................... 61
Overview ................................................................................................................................................. 61
General Properties .................................................................................................................................. 61
Epoxy Resins ............................................................................................................................................ 62
Polyurethanes.......................................................................................................................................... 67
Phenolics ................................................................................................................................................. 69
Unsaturated Polyesters ........................................................................................................................... 72
Diallyl Phthalate ...................................................................................................................................... 75
BT-Epoxy Resins and Cyanate Esters ....................................................................................................... 76
Thermoset Market Estimates and Forecasts Summary .......................................................................... 77
Chapter 5: Overview of Key Components, PCBs and Encapsulants ...................... 79
Introduction ................................................................................................................................................ 79
Focus of This Report .................................................................................................................................... 79
Resin Consumption ..................................................................................................................................... 80
Background .............................................................................................................................................. 80
Markets ................................................................................................................................................... 80
Growth..................................................................................................................................................... 80
Market Drivers ......................................................................................................................................... 81
Printed Circuit Boards ................................................................................................................................. 81
Overview ................................................................................................................................................. 81
Property Requirements for Laminates .................................................................................................... 82
Physical Composition .............................................................................................................................. 83
Assembly Technologies ........................................................................................................................... 83
PCB Substrates ........................................................................................................................................ 83
Specific Polymers Used in Printed Circuit Boards ................................................................................... 85
Other Materials Used in Printed Circuit Boards ...................................................................................... 86
Fiber Reinforcements .............................................................................................................................. 86
Production of Circuitry ............................................................................................................................ 86
Environmental Issues .............................................................................................................................. 87
Flexible Printed Circuit Boards ................................................................................................................ 88
Soldering .................................................................................................................................................. 91
Production Statistics ................................................................................................................................ 92
Industry Trends ....................................................................................................................................... 93
Electronics Packaging .............................................................................................................................. 93
Market Estimates and Forecasts ........................................................................................................... 102
Encapsulants ............................................................................................................................................. 105
Definitions and Background .................................................................................................................. 105
Primary Purposes of Encapsulation ....................................................................................................... 105
Encapsulant Materials ........................................................................................................................... 106
Epoxy Encapsulation Formulations ....................................................................................................... 107
Encapsulated Electrical and Electronics Components........................................................................... 108
Epoxy Encapsulant Systems .................................................................................................................. 108
Silicone Encapsulants ............................................................................................................................ 109
Thermoplastic Encapsulants .................................................................................................................. 109
Selected Major Encapsulant Producers and Their Product Lines.......................................................... 111
Market Estimates and Forecasts ........................................................................................................... 111
Chapter 6: Molded Electronics Products ........................................................... 114
Overview ................................................................................................................................................... 114
Background ............................................................................................................................................ 114
Polymers Used ....................................................................................................................................... 114
Market Drivers ....................................................................................................................................... 114
Connectors ................................................................................................................................................ 115
Background ............................................................................................................................................ 115
Trends .................................................................................................................................................... 115
Applications for Electronics Connectors ............................................................................................... 116
Material Selection ................................................................................................................................. 116
Flame Retardance .................................................................................................................................. 117
Standards Relating to Connectors ......................................................................................................... 119
Manufacturers ....................................................................................................................................... 120
End-Use Markets ................................................................................................................................... 121
Market Estimates and Forecasts ........................................................................................................... 123
Switches .................................................................................................................................................... 125
Background ............................................................................................................................................ 125
Market Estimates and Forecasts ........................................................................................................... 125
Coil Formers .............................................................................................................................................. 127
Background ............................................................................................................................................ 127
Manufacturers ....................................................................................................................................... 127
Market Estimates and Forecasts ........................................................................................................... 128
Relays ........................................................................................................................................................ 130
Background ............................................................................................................................................ 130
Market Estimates and Forecasts ........................................................................................................... 130
Capacitors ................................................................................................................................................. 132
Background ............................................................................................................................................ 132
Applications ........................................................................................................................................... 132
Capacitor Materials ............................................................................................................................... 133
Consumption by Market Segment ........................................................................................................ 134
Market Estimates and Forecasts ........................................................................................................... 134
Other Molded Electronics Components ................................................................................................... 135
Resistors ................................................................................................................................................ 135
Market Estimates and Forecasts ........................................................................................................... 136
Summary of Market Estimates and Forecasts .......................................................................................... 138
Chapter 7: Patent Review/ New Developments ................................................. 143
Background ............................................................................................................................................... 143
Importance of Miniaturization .................................................................................................................. 143
Thin-Walling Electronics Components ...................................................................................................... 144
Background ............................................................................................................................................ 144
Effects of Thin-Walling on Performance Requirements and Design ..................................................... 144
Application Requirements ..................................................................................................................... 144
Material and Process Selection ............................................................................................................. 145
Properties Required .............................................................................................................................. 145
Challenges in Downsizing ...................................................................................................................... 146
Software that Aids Thin-wall Design ..................................................................................................... 146
Flexible Electronics .................................................................................................................................... 146
Overview ............................................................................................................................................... 146
Wearable Electronics ................................................................................................................................ 149
Cloud Computing and Big Data ................................................................................................................. 149
The Internet of Everything ........................................................................................................................ 150
Changes in Electronics Component Manufacturing that Could Influence Resin Choices ......................... 150
Recent Patents Related to the Industry .................................................................................................... 151
Chapter 8: Electronics Components Industry Overview and Plastics Producers . 155
Top Semiconductor Producers and Customers ........................................................................................ 155
Manufacturing and Marketing Aspects .................................................................................................... 156
Globalization.......................................................................................................................................... 156
What Component Suppliers Are Doing ................................................................................................. 156
Plastics Producers ..................................................................................................................................... 157
Overview ............................................................................................................................................... 157
Polymer Producers According to Material Type ....................................................................................... 162
Thermosets ............................................................................................................................................ 162
Thermoplastics ...................................................................................................................................... 162
Chapter 9: Environmental Issues ........................................................................ 166
Overview ................................................................................................................................................... 166
Printed Circuit Board Disposal .................................................................................................................. 166
Bromine-Free Printed Circuit Boards ........................................................................................................ 166
Halogen-Free Flame Retardants for Thermoplastics ................................................................................ 167
Recycling ................................................................................................................................................... 167
Electronics Industry Interface ................................................................................................................... 168
Overview ............................................................................................................................................... 168
Reasons for Increased Environmental Regulations for Electronics Equipment .................................... 168
The European Union RoHS Directive ..................................................................................................... 169
The European Union WEEE Directive .................................................................................................... 170
EPEAT ..................................................................................................................................................... 170
Chapter 10: Performance Requirements Related to Electronics Components ... 172
Overview ................................................................................................................................................... 172
Flammability Standards ............................................................................................................................ 172
Definitions ............................................................................................................................................. 172
Flammability Tests .................................................................................................................................... 173
Overview ............................................................................................................................................... 173
UL 94 ...................................................................................................................................................... 173
Glow-Wire Flammability Index IEC 60695 .......................................................................................... 174
UL 1694 .................................................................................................................................................. 174
UL 746C.................................................................................................................................................. 175
Other Standards ........................................................................................................................................ 176
UL 1446 .................................................................................................................................................. 176
UL 1950 .................................................................................................................................................. 176
Chapter 11: Company Profiles ........................................................................... 178
Appendix: Acronyms .......................................................................................... 188
About BCC Research ......................................................................................... 191
About BCC Research.................................................................................................................................. 192
BCC Membership ...................................................................................................................................... 192
BCC Custom Research ............................................................................................................................... 192

List of Table

List of Tables
Summary Table Global Electronics Components Market, by Type of Polymer, Through 2022 (Million Pounds) ......................................................................................................................................................... 8
Table 1 Examples of Standard Nylons Used to Mold Electronics Components, by Trade Name .............. 26
Table 2 Global Standard Nylon Electronics Components Consumption, by Application, Through 2022 (Million Pounds) .......................................................................................................................................... 28
Table 3 Examples of Polybutylene Terephthalates Used to Mold Electronics Components, by Trade Name ........................................................................................................................................................... 30
Table 4 Global Polybutylene Terephthalate Electronics Components Market, by Application, Through 2022 (Million Pounds) ................................................................................................................................. 33
Table 5 Global PET/PCT Electronics Components Market, by Application, Through 2022 (Million Pounds) .................................................................................................................................................................... 34
Table 6 Examples of Polyphenylene Sulfide and Polyphenylene Sulfide Blends Used to Mold Electronics Components, by Trade Name ..................................................................................................................... 36
Table 7 Global Polyphenylene Sulfide Electronics Components Market, by Application, Through 2022 (Million Pounds) .......................................................................................................................................... 38
Table 8 Global Polyimide* Electronics Components Market, by Application, Through 2022 (Million Pounds) ....................................................................................................................................................... 41
Table 9 Examples of Polycarbonates Used to Mold Electronics Components, by Trade Name ................ 43
Table 10 Global Polycarbonate Electronics Components Market, by Application, Through 2022 (Million Pounds) ....................................................................................................................................................... 44
Table 11 Examples of Polyphthalamide Polymers used to Mold Electronics Components, by Trade Name .................................................................................................................................................................... 46
Table 12 Global Polyphthalamides and High-Temperature Nylon Electronics Components Market, by Application, Through 2022 (Million Pounds) .............................................................................................. 48
Table 13 Examples of Liquid Crystal Polymers Used to Mold Electronics Components, by Trade Name . 50
Table 14 Global Liquid Crystal Polymer Electronics Components Market, by Application, Through 2022 (Million Pounds) .......................................................................................................................................... 51
Table 15 Global Sulfone Polymer Electronics Components Market, by Application, Through 2022 (Million Pounds) ....................................................................................................................................................... 53
Table 16 Global Polymer Alloy/Blend Electronics Components Market, by Application, Through 2022 (Million Pounds) .......................................................................................................................................... 55
Table 17 Global Fluoropolymer Electronics Components Market, by Application, Through 2022 (Million Pounds) ....................................................................................................................................................... 56
Table 18 Examples of PAEK Used to Mold Electronics Components, by Trade Name ............................... 58
Table 19 Global Polyaryletherketone Electronics Components Market, by Application, Through 2022 (Million Pounds) .......................................................................................................................................... 59
Table 20 Global Thermoplastic Electronics Components Market, by Type, Through 2022 (Million Pounds) .................................................................................................................................................................... 60
Table 21 Thermoset Properties and Manufacturing Processes .................................................................. 62
Table 22 Examples of Epoxy Resins Used for Electronics Components, by Trade Name ........................... 65
Table 23 Global Epoxy Resin Electronics Components Market, by Application, Through 2022 (Million Pounds) ....................................................................................................................................................... 66
Table 24 Examples of Polyurethane Systems Used for Electronics Components, by Trade Name ........... 68
Table 25 Global Polyurethane Electronics Components Market, by Application, Through 2022 (Million Pounds) ....................................................................................................................................................... 69
Table 26 Examples of Phenolics Used for Electronics Components, by Trade Name................................. 71
Table 27 Global Phenolic Electronics Components Market, by Application, Through 2022 (Million Pounds) ....................................................................................................................................................... 72
Table 28 Examples of Unsaturated Polyester and Vinyl Ester and Compounds Used for Electronics Components, by Trade Name ..................................................................................................................... 74
Table 29 Global Unsaturated Polyester Electronics Components Market, by Application, Through 2022 (Million Pounds) .......................................................................................................................................... 75
Table 30 Global Diallyl Phthalate Electronics Components Market, by Application, Through 2022 (Million Pounds) ....................................................................................................................................................... 76
Table 31 Global Thermoset Electronics Components Market, by Type, Through 2022 (Million Pounds).. 77
Table 32 Important Technical Factors to Consider When Selecting Printed Circuit Board Substrate Materials ..................................................................................................................................................... 84
Table 33 Comparison between Rigid and Flexible Circuit Boards .............................................................. 90
Table 34 Major Producers of Rigid and Flexible Circuit Boards .................................................................. 91
Table 35 Polymers Suitable for Production of 3D-MIDs Using LDS Technology ...................................... 101
Table 36 Advantages and Disadvantages of LDS and Two-component Molding for 3D-MIDs ................ 102
Table 37 Global PCB Market, by Polymer Type, Through 2022 (Million Pounds)..................................... 103
Table 38 Global PCB* Market, by Thermoplastic Type, Through 2022 (Million Pounds) ........................ 103
Table 39 Global PCB Market, by Thermoset Type, Through 2022 (Million Pounds) ................................ 104
Table 40 Types of Encapsulant Materials Advantages and Disadvantages........................................... 107
Table 41 Epoxy Encapsulant Formulations .............................................................................................. 107
Table 42 Global Electronics Encapsulants Market, by Polymer Type, Through 2022 (Million Pounds) .. 111
Table 43 Global Electronics Encapsulants Market, by Thermoplastic Type, Through 2022 (Million Pounds) .................................................................................................................................................................. 112
Table 44 Global Electronics Encapsulants Market, by Thermoset Type, Through 2022 (Million Pounds) .................................................................................................................................................................. 112
Table 45 Major Manufacturers of Electronics Connectors ....................................................................... 120
Table 46 Global Electronics Connector Market, by Polymer Type, Through 2022 (Million Pounds) ....... 123
Table 47 Global Electronics Connector Market, by Thermoplastic Type, Through 2022 (Million Pounds) .................................................................................................................................................................. 123
Table 48 Global Electronics Connector Market, by Thermoset Type, Through 2022 (Million Pounds) ... 124
Table 49 Global Electronics Components Switch Market, by Polymer Type, Through 2022 (Million Pounds) ..................................................................................................................................................... 126
Table 50 Global Electronics Components Switch Market, by Thermoplastic Type, Through 2022 (Million Pounds) ..................................................................................................................................................... 126
Table 51 Global Electronics Components Switch Market, by Thermoset Type, Through 2022 (Million Pounds) ..................................................................................................................................................... 127
Table 52 Selected Manufacturers Molding Coil Formers for Electronics Applications ............................ 128
Table 53 Global Coil-Former Market, by Polymer Type, Through 2022 (Million Pounds) ........................ 128
Table 54 Global Coil-Former Market, by Thermoplastic Type, Through 2022 (Million Pounds) .............. 129
Table 55 Global Coil-Former Market, by Thermoset Type, Through 2022 (Million Pounds) .................... 130
Table 56 Global Relay Market, by Polymer Type, Through 2022 (Million Pounds) .................................. 131
Table 57 Global Relay Market, by Thermoplastic Type, Through 2022 (Million Pounds) ........................ 131
Table 58 Global Relay Market, by Thermoset Type, Through 2022 (Million Pounds) .............................. 132
Table 59 Global Capacitor Market, by Thermoplastic Type, Through 2022 (Million Pounds) .................. 135
Table 60 Global Other Electronics Components Market, by Polymer Type, Through 2022 (Million Pounds) .................................................................................................................................................................. 137
Table 61 Global Other Electronics Components Market, by Thermoplastic Type, Through 2022 (Million Pounds) ..................................................................................................................................................... 137
Table 62 Global Other Electronics Components Market, by Thermoset Type, Through 2022 (Million Pounds) ..................................................................................................................................................... 138
Table 63 Global Electronics Components Market, by Application, Through 2022 (Million Pounds) ....... 139
Table 64 Global Thermoplastic Electronics Components Market, by Application, Through 2022 (Million Pounds) ..................................................................................................................................................... 139
Table 65 Global Thermoset Electronics Components Market, by Application, Through 2022 (Million Pounds) ..................................................................................................................................................... 140
Table 66 Top Global Semiconductor Producer Companies, 2016 ($ Billions) .......................................... 155
Table 67 Top Global Semiconductor Customers, 2016 ($ Billions) ........................................................... 156
Table 68 Trade Names of Selected Plastics Used in Electronics Components ......................................... 158

List of Chart

List of Figures
Summary Figure Global Electronics Components Market, by Type of Polymer, 2016-2022 (Million Pounds) ......................................................................................................................................................... 8

Make an enquiry before buying this Report

Please fill the enquiry form below.

  • Full Name *
  • Your Email *
  • Job Title *
  • Company *
  • Phone No. * (Pls. Affix Country Code)
  • Message
  • Security Code *