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Global Wire Bonder Equipment Market 2017-2021

Published By :

Technavio

Published Date : May 2017

Category :

Semiconductors

No. of Pages : 70 Pages

About Wire Bonder Equipment
Wire bonder equipment is the machinery used for making interconnects between an IC or any other semiconductor device at the time of packaging. This interconnection ensures the flow of electricity in the semiconductor device. The thin-wire used to make these connections are usually made of copper, gold, aluminum, or silver. Wire bonder equipment is part of the semiconductor assembly and packaging process.

Technavios analysts forecast the global wire bonder equipment market to grow at a CAGR of 2.88% during the period 2017-2021.

Covered in this report
The report covers the present scenario and the growth prospects of the global wire bonder equipment market for 2017-2021. To calculate the market size, the report considers the new installations, shipments, and sales of wire bonding systems in the semiconductor market.

The market is divided into the following segments based on geography:
Americas
APAC
EMEA

Technavio's report, Global Wire Bonder Equipment Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
ASM Pacific Technology
Kulicke& Soffa
Palomar Technologies
Other prominent vendors
Besi
DIAS Automation
F&K Delvotec Bondtechnik
Hesse
Hybond
SHINKAWA Electric
Toray Engineering
West Bond
Market driver
Incentives and discounts for long-term customers
For a full, detailed list, view our report

Market challenge
High investment market
For a full, detailed list, view our report

Market trend
Growing use of 3D chip packaging
For a full, detailed list, view our report

Key questions answered in this report
What will the market size be in 2021 and what will the growth rate be?
What are the key market trends?
What is driving this market?
What are the challenges to market growth?
Who are the key vendors in this market space?
What are the market opportunities and threats faced by the key vendors?
What are the strengths and weaknesses of the key vendors?

You can request one free hour of our analysts time when you purchase this market report. Details are provided within the report.




Table of Contents
PART 01: Executive summary
PART 02: Scope of the report
PART 03: Research Methodology
PART 04: Introduction
Key market highlights
PART 05: Market landscape
Overview of semiconductor packaging and assembly equipment
Ecosystem of semiconductor IC packaging industry
Wire bonder market overview
Market size and forecast
Five forces analysis
PART 06: Market segmentation by product
Global wire bonder equipment market by product
Ball bonders
Stud-bump bonders
Wedge bonders
PART 07: Market segmentation by end-user
Global wire bonder equipment market by end-user
OSATs
Market size and forecast
PART 08: Geographical segmentation
Global wire bonder equipment market by geography
APAC
Americas
EMEA
PART 09: Key leading countries
Key leading countries
Taiwan
South Korea
Japan
China
PART 10: Decision framework
PART 11: Drivers and challenges
Market drivers
Impact of drivers on key customer segments
Market challenges
Impact of challenges on key customer segments
PART 12: Market trends
Growing use of 3D chip packaging
Increase in number of OSAT vendors
Trend of M&A in the packaging and assembly market
Advent of FOWLP technology
Automation in automobiles
PART 13: Vendor landscape
Competitive scenario
Key vendors
Other prominent vendors
PART 14: Appendix
List of abbreviations
List of Exhibits
Exhibit 01: Comparison of wire bonding techniques
Exhibit 02: Comparison of the three types of wire bonds
Exhibit 03: Steps involved in back-end chip formation
Exhibit 04: Supply chain of traditional semiconductor IC packaging industry
Exhibit 05: Supply chain of new semiconductor IC packaging industry
Exhibit 06: Overview of global wire bonder equipment market
Exhibit 07: Global wire bonder equipment market 2016-2021 ($ millions)
Exhibit 08: Five forces analysis
Exhibit 09: Global wire bonder equipment market by product 2016-2021 (% share of revenue)
Exhibit 10: Revenue trend line of global wire bonder equipment market by product 2016-2021 ($ millions)
Exhibit 11: Global ball bonder equipment market by ball bonders 2016-2021 ($ millions)
Exhibit 12: Global wire bonder equipment market by stud-bump bonders 2016-2021 ($ millions)
Exhibit 13: Global wedge bonder equipment market by wedge bonders 2016-2021 ($ millions)
Exhibit 14: Global wire bonder equipment market by end-user 2016-2021 (% share of revenue)
Exhibit 15: Revenue trend line of the global wire bonder equipment market by end-user 2016-2021 ($ millions)
Exhibit 16: Global wire bonder equipment market by OSATs 2016-2021 ($ millions)
Exhibit 17: Global wire bonder equipment market by IDMs 2016-2021 ($ millions)
Exhibit 18: Global wire bonder equipment market by geography 2016-2021 (% share of revenue)
Exhibit 19: Global wire bonder equipment market by geography ($ millions)
Exhibit 20: Wire bonder equipment market in APAC 2016-2021 ($ millions)
Exhibit 21: Wire bonder equipment market in Americas 2016-2021 ($ millions)
Exhibit 22: Wire bonder equipment market in EMEA 2016-2021 ($ millions)
Exhibit 23: Key leading countries
Exhibit 24: Percentage share of key leading countries 2016-2021
Exhibit 25: Forecast by application of semiconductor devices 2016 and 2021 (% share of unit shipments)
Exhibit 26: Impact of drivers
Exhibit 27: Global semiconductor market trend 1990-2016 ($ billions)
Exhibit 28: Impact of challenges
Exhibit 29: Other prominent vendors

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