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Global System-in-Package Market 2016-2020

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Published Date : Oct 2016

Category :


No. of Pages : 67 Pages

About SiP
A SiP contains several chips such as a specialized processor, dynamic random access memory (DRAM), and flash memory. These chips are combined with passive components such as resistors and capacitors, which are placed on one substrate, requiring only a few external components to make it functional. Thus, devices packaged using this technology are ideal for space constrained environments such as smart devices. This reduces integration complexities on the printed circuit board (PCB) as well as making the overall design simpler.
Technavios analysts forecast the global SiP market to grow at a CAGR of 10.29% during the period 2016-2020.

Covered in this report
The report covers the present scenario and the growth prospects of the global SiP market for 2016-2020. To calculate the market size, the report considers the revenue generated from the sales of SiP systems.

The market is divided into the following segments based on geography:

Technavio's report, Global SiP Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
Amkor Technology

Other prominent vendors
ChipMOS Technology
ChipSiP Technology
Octavo Systems
Samsung Electro-Mechanics

Market driver
Need to control rising costs
For a full, detailed list, view our report

Market challenge
High inventory levels in supply chain
For a full, detailed list, view our report

Market trend
Growth of OSAT vendors
For a full, detailed list, view our report

Key questions answered in this report
What will the market size be in 2020 and what will the growth rate be?
What are the key market trends?
What is driving this market?
What are the challenges to market growth?
Who are the key vendors in this market space?
What are the market opportunities and threats faced by the key vendors?
What are the strengths and weaknesses of the key vendors?

You can request one free hour of our analysts time when you purchase this market report. Details are provided within the report.

Table of Content
PART 01: Executive summary
PART 02: Scope of the report
Source year and forecast period
Market overview
Geographical coverage
Vendor segmentation
Common currency conversion rates
Top-vendor offerings
PART 03: Market research methodology
Research methodology
Economic indicators
PART 04: Introduction
Key market highlights
PART 05: Technology overview
Back-end chip formation
Wafer-level versus die-level packaging and assembly
Evolution of semiconductor packaging industry
Eco-system of semiconductor IC packaging industry
PART 06: Market landscape
Market overview
Comparison between SoC, SiP, and chip-on-board (CoB)
Market size and forecast
Five forces analysis
PART 07: Market segmentation by application
Communications sector
Consumer electronics sector
Computers sector
Automotive sector
Medical sector
PART 08: Market segmentation by interconnect technology
Wire bond packaging
Flip-chip packaging
PART 09: Market segmentation by end-user
PART 10: Geographical segmentation
PART 11: Market drivers
Need to control rising costs
Emergence of advanced and compact consumer electronic devices
Rise in number of fabs
Increasing number of IoT devices
Design complexities in SoC
PART 12: Impact of drivers
PART 13: Market challenges
High inventory levels in supply chain
Fluctuation of foreign exchange rates
High investment market
PART 14: Impact of drivers and challenges
PART 15: Market trends
Growth of OSAT vendors
Emergence of FOWLP technology
Automation in automobiles
PART 16: Vendor landscape
Competitive scenario
Key vendors
Other prominent vendors
PART 17: Appendix
List of abbreviations
PART 18: Explore Technavio

List of Exhibits
Exhibit 01: Global SiP market segmentation
Exhibit 02: List of countries in key geographies
Exhibit 03: Market vendors
Exhibit 04: Currency conversions
Exhibit 05: Product offerings
Exhibit 06: Back-end chip formation steps
Exhibit 07:.5D IC block diagram
Exhibit 08:D IC block diagram
Exhibit 09: Old semiconductor IC packaging industry supply chain
Exhibit 10: New semiconductor IC packaging industry supply chain
Exhibit 11: SoC, SiP, and CoB ranking on functioning parameters
Exhibit 12: Global SiP market 2015-2020 ($ billions)
Exhibit 13: Five forces analysis
Exhibit 14: Percentage share of SiP usage in applications (2015-2020)
Exhibit 15: Percentage share of SiP usage in applications 2015-2020 ($ billions)
Exhibit 16: Global SiP market for communications sector 2015-2020 ($ billions)
Exhibit 17: Global SiP market for consumer electronics sector 2015-2020 ($ billions)
Exhibit 18: Global SiP market for computer sector 2015-2020 ($ billions)
Exhibit 19: Global SiP market for automotive sector 2015-2020 ($ billions)
Exhibit 20: Expected automotive shipment forecast y-o-y (%)
Exhibit 21: Global SiP market for medical sector 2015-2020 ($ billions)
Exhibit 22: Bonding technologies for SiP, 2015-2020 (% share)
Exhibit 23: Bonding technologies for SiP, 2015-2020 ($ billions)
Exhibit 24: Global SiP market for wire bond packaging 2015-2020 ($ billions)
Exhibit 25: Global SiP market for flip-chip packaging 2015-2020 ($ billions)
Exhibit 26: Global SiP market by end-user 2015-2020 (% share)
Exhibit 27: Global SiP market by end-user 2015-2020 ($ billions)
Exhibit 28: Global SiP market of foundries 2015-2020 ($ billions)
Exhibit 29: Global SiP market for IDMs 2015-2020 ($ billions)
Exhibit 30: Global SiP market by geography 2015-2020 (% share)
Exhibit 31: Global SiP market by geography 2015-2020 (% share)
Exhibit 32: SiP market in APAC 2015-2020 ($ billions)
Exhibit 33: SiP market in Americas 2015-2020 ($ billions)
Exhibit 34: SiP market in EMEA 2015-2020 ($ billions)
Exhibit 35: Impact of drivers
Exhibit 36: Global semiconductor market trend 1992-2015 ($ billions)
Exhibit 37: Impact of drivers and challenges
Exhibit 38: Other vendors in global SiP market

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