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Global Semiconductor Packaging Materials Market 2015-2019

Published By :

Technavio

Published Date : Feb 2015

Category :

Parts & Suppliers

No. of Pages : 100 Pages


About Semiconductor Packaging Materials

Semiconductor packaging materials comprise metals, plastic, and ceramic components. They not only protect the IC on the semiconductor die, but also interconnect the die and the PCB. They protect the die from external mechanical impacts and corrosion, and also act as an electrically conductive interconnects with excellent signal propagation properties. Excessive heat in the circuits is dissipated through heat spreaders. Packaging components vary in dimensions and functionality.

TechNavio's analysts forecast the Global Semiconductor Packaging Materials market to grow at a CAGR of 4.33 percent over the period 2014-2019.

Covered in this Report

The Global Semiconductor Packaging Materials market can be divided into seven segments based on the type of product: Organic Substrates, Bonding Wires, Leadframes, Encapsulation Resins, Ceramic Packages, Die Attach Materials, and Other Semiconductor Packaging Materials. The key consumers of these packaging materials are the Electronics Industry, the Semiconductor Industry, and the Automotive Sector.

TechNavio's report, Global Semiconductor Packaging Materials Market 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the APAC region, North America, and Europe; it also covers the Global Semiconductor Packaging Materials market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key Regions
  • APAC 
  • Europe
  • North America

Key Vendors
  • Alent
  • BASF
  • Henkel
  • Hitachi Chemical
  • Kyocera

Other Prominent Vendors
  • Beijing Doublink Solders
  • Beijing Kehua New Chemical Technology
  • Cheil Industries
  • Diehl Metall
  • Duksan Hi-metal
  • DuPont
  • Dynacraft
  • Evergreen Semiconductor Materials
  • Guangdong Rongtai
  • Heesung Metal
  • Heraeus
  • Honeywell Electronic Materials
  • Ibiden
  • Indium
  • IQE
  • KCC
  • LG Innotek
  • Lintec
  • Lord
  • Mitsui High-Tec
  • MK Electron
  • Nanya PCB
  • Ningbo Dongsheng IC
  • Nippon Micrometal
  • Nitto Denko
  • Poongsan
  • Samsung Techwin
  • Shanghai Sinyang Semiconductor Materials
  • Shin-Etsu Chemical
  • Shinko
  • Sumitomo Metal Mining
  • Tanaka Denshi Kogyo
  • Tatsuta Electronic Materials
  • Xiamen Yonghong Electronics

Key Market Driver
  • Surge in Sales of Smartphones and Smart Devices
  • For a full, detailed list, view our report

Key Market Challenge
  • High Dependency on Performance of Semiconductor Equipment Industry
  • For a full, detailed list, view our report

Key Market Trend
  • Popularity of Redistributed Chip Packaging
  • For a full, detailed list, view our report

Key Questions Answered in this Report
  • What will the market size be in 2019 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?

01. Executive Summary

02. List of Abbreviations

03. Scope of the Report
03.1 Market Overview
03.2 Product Offerings

04. Market Research Methodology
04.1 Market Research Process
04.2 Research Methodology

05. Introduction

06. Market Landscape
06.1 Market Size and Forecast
06.2 Five Forces Analysis 

07. Market Segmentation by Type of Material
07.1 Global Semiconductor Packaging Materials Market by Type of Material 2014-2019
07.2 Global Organic Substrates Market
07.2.1 Market Size and Forecast
07.3 Global Bonding Wires Market
07.3.1 Market Size and Forecast
07.4 Global Leadframes Market
07.4.1 Market Size and Forecast
07.5 Global Encapsulation Resins Market
07.5.1 Market Size and Forecast
07.6 Global Ceramic Packages Market
07.6.1 Market Size and Forecast
07.7 Global Die Attach Materials Market
07.7.1 Market Size and Forecast
07.8 Global Other Semiconductor Packaging Materials Market
07.8.1 Market Size and Forecast

08. Market Segmentation by Packaging Technology
08.1 Global SO Market
08.1.1 Market Overview
08.2 Global GA Packages Market
08.2.1 Market Overview
08.3 Global Flat No-leads Packages Market
08.3.1 Market Overview
08.4 Global QFP Market
08.4.1 Market Overview
08.5 Global DIP Market
08.5.1 Market Overview
08.6 Global Other Technologies Market
08.6.1 Market Overview

09. Geographical Segmentation
09.1 Global Semiconductor Packaging Materials Market by Geographical Segmentation 2014-2019
09.2 Semiconductor Packaging Materials Market in the APAC Region
09.2.1 Market Size and Forecast
09.3 Semiconductor Packaging Materials Market in North America
09.3.1 Market Size and Forecast
09.4 Semiconductor Packaging Materials Market in Europe
09.4.1 Market Size and Forecast

10. Key Leading Countries
10.1 Taiwan
10.2 China
10.3 Japan

11. Buying Criteria

12. Market Growth Drivers

13. Drivers and their Impact

14. Market Challenges

15. Impact of Drivers and Challenges

16. Market Trends

17. Trends and their Impact

18. Vendor Landscape
18.1 Competitive Scenario
18.2 Other Prominent Vendors

19. Key Vendor Analysis
19.1 Alent 
19.1.1 Key Facts
19.1.2 Business Overview
19.1.3 Business Segmentation By Revenue 2013
19.1.4 Key Financials by Revenue 2013 and 2014
19.1.5 Business Segmentation by Revenue 2012 and 2013
19.1.6 Geographical Segmentation by Revenue 2013
19.1.7 Business Strategy
19.1.8 SWOT Analysis
19.2 BASF
19.2.1 Key Facts
19.2.2 Business Overview
19.2.3 Business/Product Segmentation
19.2.4 Business Segmentation by Revenue 2012 and 2013
19.2.5 Geographical Segmentation by Revenue 2013
19.2.6 Business Strategy
19.2.7 Recent Developments
19.2.8 SWOT Analysis
19.3 Henkel
19.3.1 Key Facts
19.3.2 Business Overview
19.3.3 Key Brands and Technologies
19.3.4 Business Strategy
19.3.5 Recent Developments
19.3.6 SWOT Analysis
19.4 Hitachi Chemical
19.4.1 Key Facts
19.4.2 Business Overview
19.4.3 Business Segmentation by Revenue 2014
19.4.4 Business Segmentation by Revenue 2013 and 2014
19.4.5 Geographical Segmentation by Revenue 2014
19.4.6 Business Strategy
19.4.7 Recent Developments
19.4.8 SWOT Analysis
19.5 Kyocera
19.5.1 Key Facts
19.5.2 Business Overview
19.5.3 Business Segmentation by Revenue 2014
19.5.4 Business Segmentation by Revenue 2013 and 2014
19.5.5 Geographical Segmentation by Revenue 2014
19.5.6 Recent Developments
19.5.7 SWOT Analysis

20. Other Reports in this Series

List of Chart



Exhibit 1: Global Semiconductor Packaging Materials Market Segmentation by Type of Material
Exhibit 2: Global Semiconductor Packaging Materials Market Segmentation by Key Customers
Exhibit 3: Market Research Methodology
Exhibit 4: Global Semiconductor Packaging Materials Market 2014-2019 (US$ billion)
Exhibit 5: Segmentation of Global Semiconductor Packaging Materials Market by Type of Material 2014
Exhibit 6: Segmentation of Global Semiconductor Packaging Materials Market by Type of Material 2014-2019
Exhibit 7: Global Organic Substrates Market 2014-2019 (US$ billion)
Exhibit 8: Global Bonding Wires Market 2014-2019 (US$ billion)
Exhibit 9: Global Leadframes Market 2014-2019 (US$ billion)
Exhibit 10: Global Encapsulation Resins Market 2014-2019 (US$ billion)
Exhibit 11: Global Ceramic Packages Market 2014-2019 (US$ billion)
Exhibit 12: Global Die Attach Materials Market 2014-2019 (US$ billion)
Exhibit 13: Global Other Semiconductor Packaging Materials Market 2014-2019 (US$ billion)
Exhibit 14: Global Semiconductor Packaging Materials Market by Technology Segmentation
Exhibit 15: Segmentation of Global Semiconductor Packaging Materials Market by Geography 2014
Exhibit 16: Segmentation of Global Semiconductor Packaging Materials Market by Geography 2014-2019
Exhibit 17: Semiconductor Packaging Materials Market in APAC Region (US$ billion)
Exhibit 18: Semiconductor Packaging Materials Market in North America (US$ billion)
Exhibit 19: Semiconductor Packaging Materials Market in Europe (US$ billion)
Exhibit 20: Alent: Business Segmentation By Revenue 2013
Exhibit 21: Alent: Key Financials by Revenue 2013 and 2014 (US$ million)
Exhibit 22: Alent : Business Segmentation by Revenue 2012 and 2013 (US$ million)
Exhibit 23: Alent: Geographical Segmentation by Revenue 2013
Exhibit 24: BASF: Business Segmentation 2013
Exhibit 25: BASF: Business Segmentation by Revenue 2012 and 2013 (US$ billion)
Exhibit 26: BASF: Geographical Segmentation by Revenue 2013
Exhibit 27: Henkel: Key Brands and Technologies
Exhibit 28: Hitachi Chemical: Business Segmentation by Revenue 2014
Exhibit 29: Hitachi Chemical: Business Segmentation by Revenue 2013 and 2014 (US$ million)
Exhibit 30: Hitachi Chemical: Geographical Segmentation by Revenue 2014
Exhibit 31: Kyocera: Business Segmentation by Revenue 2014
Exhibit 32: Kyocera: Business Segmentation by Revenue 2013 and 2014 (US$ million)
Exhibit 33: Kyocera: Geographical Segmentation by Revenue 2014

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