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Global Semiconductor Assembly Equipment Market 2017-2021

Published By :

Technavio

Published Date : May 2017

Category :

Semiconductors

No. of Pages : 70 Pages

About Semiconductor Assembly Equipment
Semiconductor chip assembly is a key component of the semiconductor supply chain. It is a part of the back-end process of chip formation. Chip assembly basically involves attaching or joining two or more semiconductor wafers or semiconductor devices to increase the functionality of chips. Machinery is used for making interconnects between an IC or any other semiconductor device during assembly. This connection ensures the flow of electricity in the semiconductor device.

Technavios analysts forecast the global semiconductor assembly equipment market to grow at a CAGR of 3.57% during the period 2017-2021.

Covered in this report
The report covers the present scenario and the growth prospects of the global semiconductor assembly equipment market for 2017-2021. To calculate the market size, the report considers the sales of assembly equipment to end-users.

The market is divided into the following segments based on geography:
Americas
APAC
EMEA

Technavio's report, Global Semiconductor Assembly Equipment Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
ASM Pacific Technology
Kulicke & Soffa Industries
Palomar Technologies
Tokyo Electron
Tokyo Seimitsu
Other prominent vendors
Besi
ChipMOS TECHNOLOGIES
DIAS Automation
Greatek Electronics
Hesse Mechatronics
Hybond
Shinkawa
Toray Engineering
WestBond

Market driver
Incentives and discounts for long-term customers
For a full, detailed list, view our report

Market challenge
High-investment market
For a full, detailed list, view our report

Market trend
Growing use of 3D packaging technology
For a full, detailed list, view our report

Key questions answered in this report
What will the market size be in 2021 and what will the growth rate be?
What are the key market trends?
What is driving this market?
What are the challenges to market growth?
Who are the key vendors in this market space?
What are the market opportunities and threats faced by the key vendors?
What are the strengths and weaknesses of the key vendors?

You can request one free hour of our analysts time when you purchase this market report. Details are provided within the report.




Table of Contents
PART 01: Executive summary
PART 02: Scope of the report
PART 03: Research Methodology
PART 04: Introduction
Key market highlights
PART 05: Technology overview
Overview of semiconductor assembly equipment
PART 06: Market landscape
Semiconductor assembly equipment market: Overview
Market size and forecast
Five forces analysis
PART 07: Market segmentation by type
Global semiconductor assembly equipment market by type
Global semiconductor assembly equipment market by die bonding equipment
Global semiconductor assembly equipment market by inspection and dicing equipment
Global semiconductor assembly equipment market by packaging equipment
Global semiconductor assembly equipment market by wire bonding equipment
Global semiconductor assembly equipment market by plating equipment
PART 08: Market segmentation by end-user
Global semiconductor assembly equipment market by end-user
Global semiconductor assembly equipment market by OSATs
Global semiconductor assembly equipment market by IDMs
PART 09: Geographical segmentation
Global semiconductor assembly equipment market by geography
Semiconductor assembly equipment market in APAC
Semiconductor assembly equipment market in Americas
Semiconductor assembly equipment market in EMEA
PART 10: Key leading countries
Global semiconductor assembly market: Key leading countries
Taiwan
South Korea
Japan
China
PART 11: Decision framework
PART 12: Drivers and challenges
Market drivers
Impact of drivers on key customer segments
Impact of drivers on key customer segments
Market challenges
Impact of challenges on key customer segments
PART 13: Market trends
Growing use of 3D packaging technology
Increase in number of OSAT vendors
M&A in packaging and assembly market
Advent of FOWLP technology
Automation in automobiles
Increased need for semiconductor memory devices
PART 14: Vendor landscape
Competitive scenario
Major vendors
Other prominent vendors
PART 15: Appendix
List of abbreviations
List of Exhibits
Exhibit 01: Steps in back-end chip formation
Exhibit 02: Supply chain in traditional semiconductor IC packaging industry
Exhibit 03: Supply chain in new semiconductor IC packaging industry
Exhibit 04: Global semiconductor assembly equipment market: Overview
Exhibit 05: Global semiconductor assembly equipment market 2016-2021 ($ billions)
Exhibit 06: Five forces analysis
Exhibit 07: Global semiconductor assembly equipment market by type 2016-2021 (% share)
Exhibit 08: Global semiconductor assembly equipment market by type: Revenue trend line 2016-2021 ($ billions)
Exhibit 09: Global semiconductor assembly equipment market by die bonding equipment 2016-2021 ($ billions)
Exhibit 10: Global semiconductor assembly equipment market by inspection and dicing equipment 2016-2021 ($ billions)
Exhibit 11: Global semiconductor assembly equipment market by packaging equipment 2016-2021 ($ billions)
Exhibit 12: Global semiconductor assembly equipment market by wire bonding equipment 2016-2021 ($ billions)
Exhibit 13: Global semiconductor assembly equipment market plating equipment 2016-2021 ($ billions)
Exhibit 14: Global semiconductor assembly equipment market by end-user 2016-2021 (% share)
Exhibit 15: Global semiconductor assembly equipment market by end-user: Revenue trend line 2016-2021 ($ billions)
Exhibit 16: Global semiconductor assembly equipment market by OSATs 2016-2021 ($ billions)
Exhibit 17: Global semiconductor assembly equipment market by IDMs 2016-2021 ($ billions)
Exhibit 18: Global semiconductor assembly equipment by geography 2016-2021 (% share)
Exhibit 19: Global semiconductor assembly equipment market by geography: Revenue trend line 2016-2021 ($ billions)
Exhibit 20: Semiconductor assembly equipment market in APAC 2016-2021 ($ billions)
Exhibit 21: Semiconductor assembly equipment market in Americas 2016-2021 ($ billions)
Exhibit 22: Semiconductor assembly equipment market in EMEA 2016-2021 ($ millions)
Exhibit 23: Key leading countries
Exhibit 24: Global semiconductor assembly market: Key leading countries 2016-2021
Exhibit 25: Semiconductor devices by application 2016 and 2021 (% share)
Exhibit 26: Impact of drivers
Exhibit 27: Impact of drivers
Exhibit 28: Global semiconductor market trend 1992-2016 ($ billions)
Exhibit 29: Impact of challenges
Exhibit 30: CAGR of 3D NAND and DRAM 2016-2021
Exhibit 31: Global semiconductor assembly equipment market: Other prominent vendors

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