Global Semiconductor Assembly and Testing Services Market 2017-2021

Global Semiconductor Assembly and Testing Services Market 2017-2021

  • Technavio
  • October 2017
  • Parts & Suppliers
  • 75 pages

Report Description

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About Semiconductor Assembly and Testing Services

The number of electronic devices we use in our day-to-day life has been increasing in the past few decades. These devices range from simple media players, smartphones, laptops, and TVs to wearable smart watches and Internet of Things (IoT) devices such as connected thermostats, automated lighting, and remote health monitoring equipment. Semiconductor assembly and testing services (SATS) or outsourced semiconductor assembly and testing (OSAT) refers to the outsourcing of integrated circuit packaging and final product testing to third-party service providers.

Technavios analysts forecast the global semiconductor assembly and testing services market to grow at a CAGR of 5.68% during the period 2017-2021.

Covered in this report
The report covers the present scenario and the growth prospects of the global semiconductor assembly and testing services market for 2017-2021. The report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.

The market is divided into the following segments based on geography:
Americas
APAC
EMEA

Technavio's report, Global Semiconductor Assembly and Testing Services Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
Amkor Technology
ASE Group
Jiangsu Changjiang Electronics Technology (JCET)
Powertech Technology
Siliconware Precision Industries (SPIL)

Other prominent vendors
Chipbond Technology
ChipMOS TECHNOLOGIES
FormFactor
Formosa Advanced Technologies
King Yuan ELECTRONICS
Lingsen Precision Industries
PSi Technologies
SIGNETICS
Tessolve Semiconductor
Tianshui Huatian Technology
Unisem
UTAC

Market driver
Growth of cloud-based servers and big data services
For a full, detailed list, view our report

Market challenge
Highly cyclic nature of electronics industry
For a full, detailed list, view our report

Market trend
Growth of advanced system in package (SiP) modules
For a full, detailed list, view our report

Key questions answered in this report
What will the market size be in 2021 and what will the growth rate be?
What are the key market trends?
What is driving this market?
What are the challenges to market growth?
Who are the key vendors in this market space?

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Table of Contents
PART 01: Executive summary
PART 02: Scope of the report
PART 03: Research Methodology
PART 04: Introduction

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