Global and United States Aluminum Bonding Wires Market Insights, Forecast to 2027

Global and United States Aluminum Bonding Wires Market Insights, Forecast to 2027

  • QYResearch
  • September 2021
  • Chemicals
  • 138 pages

Report Description

Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. Wire bonding can be used at frequencies above 100 GHz.
Aluminum wire bonding is a process similar to gold wire bonding but with the critical distinction that the surface does not need to be heated to 150C or even anything above room temperature. Force and ultrasonics are vital to the formation of aluminum bonds. The creation of an aluminum wire bond is the same as for gold wire, which consists of two attachment points and a specific loop shape. During the attachment steps for the wire, the only factors needed for the bond are force and ultrasonics, as the surface does not need to be heated.
Aluminum bonding wire, like gold wire, provides a strong electrical path for connections between components in an assembly but has some key advantages. Aluminum bonding allows for interconnections to be formed on temperature-sensitive assemblies where the materials cannot withstand the temperatures usually required for gold bonding. Aluminum wire is also much preferred over gold wire on Aluminum surfaces in hermetically sealed packages as the temperatures needed for hermetic sealing can compromise the integrity of Au on Al bonds.
Global Aluminum Bonding Wires main manufactuers include Heraeus, Tanaka, Custom Chip Connections and World Star Electronic Material, totally accounting for 30% of the market. China is the largest market, with a share over 40%. As for the types of products, it can be divided into small diameter aluminum wires and large diameter aluminum wires. The most common type is small diameter aluminum wires, with a share over 68%. In terms of application, it is widely used in automotive electronics, consumer electronics, power supplies, computing equipment industry and military and aerospace. The most common application isautomotive electronics, which accounts for 23% of all.

Market Analysis and Insights: Global and United States Aluminum Bonding Wires Market
This report focuses on global and United States Aluminum Bonding Wires market.
In 2020, the global Aluminum Bonding Wires market size was US$ 152 million and it is expected to reach US$ 235.9 million by the end of 2027, with a CAGR of 6.3% during 2021-2027. In United States the Aluminum Bonding Wires market size is expected to grow from US$ XX million in 2020 to US$ XX million by 2027, at a CAGR of XX% during the forecast period.

Global Aluminum Bonding Wires Scope and Market Size
Aluminum Bonding Wires market is segmented by region (country), players, by Type, and by Application. Players, stakeholders, and other participants in the global Aluminum Bonding Wires market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by region (country), by Type and by Application in terms of revenue and forecast for the period 2016-2027.
For United States market, this report focuses on the Aluminum Bonding Wires market size by players, by Type, and by Application, for the period 2016-2027. The key players include the global and local players which play important roles in United States.

Segment by Type
Small Diameter Aluminum Wires
Large Diameter Aluminum Wires

Segment by Application
Automotive Electronics
Consumer Electronics
Power Supplies
Computing Equipment
Industrial
Military & Aerospace
Others

By Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE

By Company
Heraeus
Tanaka
Custom Chip Connections
World Star Electronic Material Co.,Ltd.
Ametek
Nichetech
Holdwell
Yantai YesNo Electronic Materials

Have query on this report?

Make an Enquiry
1 Study Coverage
1.1 Aluminum Bonding Wires Product Introduction
1.2 Market by Type
1.2.1 Global Aluminum Bonding Wires Market Size Growth Rate by Type
1.2.2 Small Diameter Aluminum Wires
List of Tables
Table 1. Global Aluminum Bonding Wires Market Size Growth Rate by Type, 2016 VS 2021 VS 2027 (US$ Million)
Table 2. Major Manufacturers of Small Diameter Aluminum Wires
Table 3. Major Manufacturers of Large Diameter Aluminum Wires
Table 4. Global Aluminum Bonding Wires Market Size Growth Rate by Application (2021-2027) & (K Km)
Table 5. Global Aluminum Bonding Wires Market Size by Region (K Km) & (US$ Million), 2016 VS 2021 VS 2027

Success Stories

Our Clients