Global Advanced Semiconductor Packaging Market Research Report 2021
- February 2021
- 121 pages
Segment by Type
Fan-Out Wafer-Level Packaging (FO WLP)
Fan-In Wafer-Level Packaging (FI WLP)
Flip Chip (FC)
Flip chip is the most used type in 2019, with about 44.29% market share.
Segment by Application
Aerospace and Defense
Consumer electronics is the most important market, with market shares of 39% in 2019.
Powertech Technology Inc
Walton Advanced Engineering
Production by Region
Consumption by Region
Middle East & Africa
Product Type & Applications
- Intel Corp
- Powertech Technology Inc
- Walton Advanced Engineering
- Advanced Semiconductor Packaging
- Aerospace and Defense
- Medical Devices
- Consumer Electronics
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1.1 Product Overview and Scope of Advanced Semiconductor Packaging
1.2 Advanced Semiconductor Packaging Segment by Type
1.2.1 Global Advanced Semiconductor Packaging Market Size Growth Rate Analysis by Type 2021 VS 2027
1.2.2 Fan-Out Wafer-Level Packaging (FO WLP)
Table 1. Global Advanced Semiconductor Packaging Market Size by Type (M Units) & (US$ Million) (2021 VS 2027)
Table 2. Global Advanced Semiconductor Packaging Consumption (M Units) Comparison by Application: 2016 VS 2021 VS 2027
Table 3. Advanced Semiconductor Packaging Market Size Comparison by Region: 2016 VS 2021 VS 2027
Table 4. Global Advanced Semiconductor Packaging Production Capacity (M Units) by Manufacturers
Table 5. Global Advanced Semiconductor Packaging Production (M Units) by Manufacturers (2016-2021)
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