Global Advanced Semiconductor Packaging Market Research Report 2021

Global Advanced Semiconductor Packaging Market Research Report 2021

  • QYResearch
  • February 2021
  • Semiconductors
  • 121 pages

Report Description

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1
The research report includes specific segments by region (country), by manufacturers, by Type and by Application. Each type provides information about the production during the forecast period of 2016 to 2027. by Application segment also provides consumption during the forecast period of 2016 to 2027. Understanding the segments helps in identifying the importance of different factors that aid the market growth.

Segment by Type
Fan-Out Wafer-Level Packaging (FO WLP)
Fan-In Wafer-Level Packaging (FI WLP)
Flip Chip (FC)
2.5D/3D
Others
Flip chip is the most used type in 2019, with about 44.29% market share.

Segment by Application
Telecommunications
Automotive
Aerospace and Defense
Medical Devices
Consumer Electronics
Consumer electronics is the most important market, with market shares of 39% in 2019.

By Company
Amkor
SPIL
Intel Corp
JCET
ASE
TFME
TSMC
Huatian
Powertech Technology Inc
UTAC
Nepes
Walton Advanced Engineering
Kyocera
Chipbond
Chipmos

Production by Region
North America
Europe
China
Japan
Taiwan
Southeast Asia

Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Philippines
Vietnam
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
U.A.E

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1 Advanced Semiconductor Packaging Market Overview
1.1 Product Overview and Scope of Advanced Semiconductor Packaging
1.2 Advanced Semiconductor Packaging Segment by Type
1.2.1 Global Advanced Semiconductor Packaging Market Size Growth Rate Analysis by Type 2021 VS 2027
1.2.2 Fan-Out Wafer-Level Packaging (FO WLP)
List of Tables
Table 1. Global Advanced Semiconductor Packaging Market Size by Type (M Units) & (US$ Million) (2021 VS 2027)
Table 2. Global Advanced Semiconductor Packaging Consumption (M Units) Comparison by Application: 2016 VS 2021 VS 2027
Table 3. Advanced Semiconductor Packaging Market Size Comparison by Region: 2016 VS 2021 VS 2027
Table 4. Global Advanced Semiconductor Packaging Production Capacity (M Units) by Manufacturers
Table 5. Global Advanced Semiconductor Packaging Production (M Units) by Manufacturers (2016-2021)

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