Market outlook of the 3D IC market
Technavios research analyst predicts the global 3D IC market to grow at a CAGR above 79% during the forecast period. The demand for compact and high-performance ICs in smartphones, tablet PCs, smart TVs, automotive products, and heavy equipment is the primary growth driver for this market. In comparison to 2D ICs, they have better performance and high bandwidth. Moreover, 3D ICs have a lesser number of interconnections between the packages, consumes less power, and require less space on electronic boards.
The high proliferation of IoT devices is expected to boost the market growth during the forecast period. Vendors in IoT market are constantly innovating in designing, manufacturing, and packaging. This enables them to come up with new IoT products in different verticals such as consumer electronics, healthcare, and manufacturing. 3D MEMS and sensors are used to capture data in a real-time scenario, which helps the company in increasing the returns by streamlining the process, increasing productivity, and enabling predictive maintenance. They also reduce the maintenance cost and the possibility of a sudden stop of work due to machinery failure.
Product segmentation and analysis of the 3D IC market
The memory product segment dominated the market during 2014, with a market share of over 62%. Technological advances such as high storage capacity and less power consumption are increasing the adoption of 3D NAND and DDR4 DRAM in smartphones, tablet PCs, consumer electronics, and automotive products, thereby driving the growth of the 3D memory chips.
Geographical segmentation and analysis of the 3D IC market
APAC accounted for 52% of the market share during 2014 and is expected to grow at a CAGR of 86% during the forecast period. The high growth in memory product segment and presence of several prominent manufacturers in the mobile and consumer electronics market such as Xiaomi, Samsung, LG, HTC, ZTE, Huawei, Lenovo, and Sony is expected to create a high demand for 3D ICs in the region during the forecast period.
Competitive landscape and key vendors
The global 3D IC market is at the nascent stage and manufacturers are aiming for the first mover advantage by making an early entry into the market. The vendors in the market compete on the basis of price, quality, innovation, and technology. Collaborations between OSAT, IDMs, and OEMs is expected to bring down the cost of 3D ICs in the coming years.
The leading vendors in the market are -
Advanced Semiconductor Engineering (ASE)
Taiwan Semiconductors Manufacturing (TSMC)
Other prominent vendors in the market include Intel, Micron, SanDisk, SK Hynix, STATS ChipPAC, United Microelectronics, and Xilinx.
Key questions answered in the report include
What will the market size and the growth rate be in 2019?
What are the key factors driving the global 3D IC market?
What are the key market trends impacting the growth of the 3D IC market?
What are the challenges to market growth?
Who are the key vendors in this market space?
What are the market opportunities and threats faced by the vendors in the global 3D IC market?
Trending factors influencing the market shares of the Americas, APAC, and EMEA?
What are the key outcomes of the five forces analysis of the 3D IC market?
Technavio also offers customization on reports based on specific client requirement.
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PART 01: Executive summary
PART 02: Scope of the report
PART 03: Market research methodology
PART 04: Introduction
Key market highlights
PART 05: Market landscape
Ecosystem of 3D ICs
Market size and forecast
Five forces analysis
PART 06: Market segmentation by product types
Market size and forecast
PART 07: Geographical segmentation
Market size and forecast
PART 08: Market drivers
Impact of drivers
PART 09: Market challenges
PART 10: Impact of drivers and challenges
PART 11: Market trends
PART 12: Vendor landscape
Other prominent vendors
PART 13: Key vendor analysis
PART 14: Key recommendations for vendors/investors
PART 15: Appendix
List of abbreviations
PART 16: Explore Technavio
Exhibit 01: Global 3D IC market segments: A snapshot
Exhibit 02: Product offerings
Exhibit 03: Global semiconductor market overview 2014
Exhibit 04: 2.5D IC block diagram
Exhibit 05: 3D IC block diagram
Exhibit 06: Global semiconductor market (% share)
Exhibit 07: Global 3D IC market 2014-2019 ($ billions)
Exhibit 08: Five forces analysis
Exhibit 09: Global 3D IC market by products 2014 (% share)
Exhibit 10: Global 3D IC market 2014-2019 by products (% share)
Exhibit 11: Global 3D IC market 2014-2019 by products ($ billions)
Exhibit 12: Global 3D IC market by geography 2014 (% share)
Exhibit 13: Global 3D IC market by geography 2014-2019 (% share)
Exhibit 14: Global 3D IC market by geography 2014-2019 ($ billions)
Exhibit 15: CAGR of global 3D IC market by geography 2014-2019
Exhibit 16: Impact of market drivers on key customer segments
Exhibit 17: IoT spending and device penetration
Exhibit 18: Impact of drivers and challenges
Exhibit 19: ASE: Business segmentation 2014 by revenue
Exhibit 20: ASE: Business segmentation by revenue 2013 and 2014 (in billions)
Exhibit 21: ASE: Geographical segmentation by revenue 2013
Exhibit 22: Samsung Electronics: Business segmentation 2013
Exhibit 23: Samsung Electronics: Business segmentation by revenue 2013 and 2014 ($ billions)
Exhibit 24: Samsung Electronics: Geographical segmentation by revenue 2014
Exhibit 25: STMicroelectronics: Business segmentation 2014 by revenue
Exhibit 26: STMicroelectronics: Business segmentation by revenue 2013 and 2014 ($ in billions)
Exhibit 27: STMicroelectronics: Geographical segmentation by revenue 2014
Exhibit 28: TSMC: Business segmentation by revenue 2014
Exhibit 29: TSMC: Business segmentation by revenue 2013 and 2014 ($ billions)
Exhibit 30: TSMC: Geographical segmentation by revenue 2014
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