Global 3D IC and 2.5D IC Packaging Market Professional Survey Report 2017

Global 3D IC and 2.5D IC Packaging Market Professional Survey Report 2017

  • QYResearch
  • January 2017
  • 3D
  • 129 pages

Report Description

1
1
Notes:
Production, means the output of 3D IC and 2.5D IC Packaging
Revenue, means the sales value of 3D IC and 2.5D IC Packaging

This report studies 3D IC and 2.5D IC Packaging in Global market, especially in North America, China, Europe, Southeast Asia, Japan and India, with production, revenue, consumption, import and export in these regions, from 2011 to 2015, and forecast to 2021.

This report focuses on top manufacturers in global market, with production, price, revenue and market share for each manufacturer, covering
Tezzaron
ASE Group
Amkor Technology
STATS ChipPAC Ltd.

By types, the market can be split into
3D wafer-level chip-scale packaging
3D TSV
2.5D

By Application, the market can be split into
Consumer electronics
Telecommunication
Industrial sector
Automotive
Military and aerospace
Smart technologies
Medical devices

By Regions, this report covers (we can add the regions/countries as you want)
North America
China
Europe
Southeast Asia
Japan
India


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Table of Contents
Global 3D IC and 2.5D IC Packaging Market Professional Survey Report 2017
1 Industry Overview of 3D IC and 2.5D IC Packaging
1.1 Definition and Specifications of 3D IC and 2.5D IC Packaging
1.1.1 Definition of 3D IC and 2.5D IC Packaging
List of Tables and Figures
Figure Picture of 3D IC and 2.5D IC Packaging
Table Product Specifications of 3D IC and 2.5D IC Packaging
Table Classification of 3D IC and 2.5D IC Packaging
Figure Global Production Market Share of 3D IC and 2.5D IC Packaging by Type in 2015
Figure 3D wafer-level chip-scale packaging Picture

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