Bond Wire Packaging Material Market - Global Industry Analysis, Size, Share, Growth, Trends and Forecast 2016 - 2024

Bond Wire Packaging Material Market - Global Industry Analysis, Size, Share, Growth, Trends and Forecast 2016 - 2024

  • Transparency Market Research
  • Ongoing
  • Semiconductors

Report Description

The global market for Bonding Wire Packaging Material is growing and is expected to increase during the forecasted period.

The diameter of bonding wires ranges from 15 micrometers to several hundred micrometers for high-powered applications. An important market trend that is expected to boost the global Bonding Wire Packaging Material market is the migration to smaller diameter wires. This migration is primarily fueled by the increasing demand for miniaturization. Manufacturers are using bonding wires as an intermediate product opts for small diameter bonding wires because it is an effective way to reduce costs, as materials used in bonding wires such as gold accounts for majority of the expense.

The growing demand for miniaturization in the semi-conductor industry is also leading to an increasing use of bonding wires as an important part of electronic assemblies. This is another factor driving the growth of the market for Bonding Wire Packaging Material. Fine and ultrafine bonding wires of palladium, copper, aluminum, and gold are used in the production of bonding wires. Uniform wires with quality is in high demand. Since the semi-conductor industry is constantly evolving, there is a need for the vendors in this market to continually upgrade their offerings with more compact and advanced packaging materials, such as wires with smaller diameter, to cater to the customer requirements.

Despite a number of factors driving the growth of the market for Bond Wire Packaging Material there are some factors restraining the market. One such challenge is the growing demandof flip chip packaging technology. The key advantage of flip chip technology over bonding wires is the elimination of the technical limitations of the bonding wires by providing an area-array interconnect and significantly lowering interconnect inductance, enabling higher frequency performance.

Another important constraint restraining the market for Bond Wire Packaging Material is the rise in the price of raw materials such as the rise in the price of gold, an important intermediate product for bond wires.

The global Bonding Wire Packaging Material market is segmented on the basis of material type and geography. By material type the global Wire Packaging Material market is sub-segmented as Silver, Copper, Palladium-coated copper (PCC), and gold. The market share in terms of volume used for bonding wires was dominated by gold, however the recent steep rise in the price of gold lead to a decrease in its demand. Due to this the industry is shifting towards the use of copper and other materials, which also includes silver, a new addition since 2010. It is expected that the demand for PCC will increase and the PCC segment will command a significant share of the global Bond Wire Packaging Material market during the forecasted period. PCC coated wires also have the added advantage of being resistant to corrosion and oxidation.

On the basis of geography the global Bonding Wire Packaging Material market is categorized as North America, Asia-Pacific (APAC), Europe, Middle East & Africa (MEA), and Latin America. In 2015, by region, the global market for Bonding Wire Packaging Material was dominated by APAC and it accounted for a significant share of the total market. This dominance of APAC is the likely result of the presence of several semiconductor manufacturing giants in this part of the world. Moreover, factors such as the use of alternative materials for packaging and technological advancements will play a crucial role in the growth of this region during the forecasted period.

The key players in the market for global Wire Packaging Material includes MK Electron Co Ltd (South Korea), California Fine Wire (U.S), Heraeus Deutschland (Germany), and TANAKA Precious Metals (Japan). Other prominent players in the market includes Tatsuta Electric Wire & Cable (Japan), Sumitomo Metal Mining (Japan), SHINKAWA Ltd (Japan), RED Micro Wire (Singapore), Palomar Technologies (U.S), Inseto (U.K), EMMTECH (India), and AMETEK (U.S).

The report offers a comprehensive evaluation of the market. It does so via in-depth qualitative insights, historical data, and verifiable projections about market size. The projections featured in the report have been derived using proven research methodologies and assumptions. By doing so, the research report serves as a repository of analysis and information for every facet of the market, including but not limited to: Regional markets, technology, types, and applications.

The study is a source of reliable data on:

  • Market segments and sub-segments
  • Market trends and dynamics
  • Supply and demand
  • Market size
  • Current trends/opportunities/challenges
  • Competitive landscape
  • Technological breakthroughs
  • Value chain and stakeholder analysis

The regional analysis covers:

  • North America (U.S. and Canada)
  • Latin America (Mexico, Brazil, Peru, Chile, and others)
  • Western Europe (Germany, U.K., France, Spain, Italy, Nordic countries, Belgium, Netherlands, and Luxembourg)
  • Eastern Europe (Poland and Russia)
  • Asia Pacific (China, India, Japan, ASEAN, Australia, and New Zealand)
  • Middle East and Africa (GCC, Southern Africa, and North Africa)

The report has been compiled through extensive primary research (through interviews, surveys, and observations of seasoned analysts) and secondary research (which entails reputable paid sources, trade journals, and industry body databases). The report also features a complete qualitative and quantitative assessment by analyzing data gathered from industry analysts and market participants across key points in the industry’s value chain.

A separate analysis of prevailing trends in the parent market, macro- and micro-economic indicators, and regulations and mandates is included under the purview of the study. By doing so, the report projects the attractiveness of each major segment over the forecast period.

Highlights of the report:

  • A complete backdrop analysis, which includes an assessment of the parent market
  • Important changes in market dynamics
  • Market segmentation up to the second or third level
  • Historical, current, and projected size of the market from the standpoint of both value and volume
  • Reporting and evaluation of recent industry developments
  • Market shares and strategies of key players
  • Emerging niche segments and regional markets
  • An objective assessment of the trajectory of the market
  • Recommendations to companies for strengthening their foothold in the market

Note: Although care has been taken to maintain the highest levels of accuracy in TMR’s reports, recent market/vendor-specific changes may take time to reflect in the analysis.

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