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Smart Packaging Comes To Market: Brand Enhancement with Electronics 2013-2023

IDTechEx
Published Date » 2013-02-01
No. Of Pages » 299
   
 Electronics and electrics are already used in packaging, from winking rum bottles and talking pizza boxes to aerosols that emit electrically charged insecticide that chases the bug. We even have medication that records how much is taken and when and prompts the user. Reprogrammable phone decoration has arrived. But that is just a warm up.  
   
 The key enabling technology - printed electronics - is about to reduce costs by 99%. Consequently, many leading brand owners have recently put multidisciplinary teams onto the adoption of the new paper thin electronics on their high volume packaging. It will provide a host of consumer benefits and make competition look very tired indeed. This is mainly about modern merchandising - progressing way beyond static print - and...
Table of Content

1. EXECUTIVE SUMMARY AND CONCLUSIONS
1.1. Benchmarking validation of figures
1.2. Market sub sectors merge
1.2.1. EAS and RFID
1.3. Reasons for the slow start
1.3.1. Unbalanced supply chain
1.3.2. Many examples of e-packaging
1.3.3. Little market pull
1.3.4. Tipping point
1.3.5. P&G and printed electronics
1.3.6. Using more of the human senses and in a better way
1.3.7. Reusable electronic packaging
1.3.8. Major adoption is certain now
1.3.9. The forthcoming e-Label
1.3.10. Technology push
1.4. Market drivers
1.4.1. Two routes for e-packaging
1.4.2. Price sensitivity
1.4.3. Basic hardware platforms are essential to achieve volume
1.5. New components and creative design
1.5.1. New design paradigms
1.5.2. Electronic graphic design
1.5.3. Diageo needs
1.6. Market Background

2. INTRODUCTION
2.1. Types of packaging
2.1.1. Demographic timebomb
2.2. Why progress is now much faster
2.2.1. Using the nine human senses
2.2.2. AstraZeneca Diprivan chipless RFID
2.3. Why basic hardware platforms are essential
2.3.1. Argument for printing standard circuits
2.3.2. Touch and hearing
2.3.3. Smell
2.4. Why e-packaging has been slow to appear
2.4.1. Inadequate market research
2.4.2. Lack of market pull
2.4.3. Wrong priorities by developers - engineering led design
2.4.4. Inadequate cost reduction
2.4.5. Odd inventions not economy of scale/hardware platforms
2.4.6. Failure to solve technical problems
2.4.7. Legal constraints
2.4.8. Lessons from brand enhancement of cars using printed electronics

3. THE NEED FOR ELECTRONICS IN PACKAGING
3.1. Safety
3.2. Security and reducing crime
3.3. Uniqueness/ product differentiation
3.4. Convenience
3.5. Leveraging the brand with extra functions, brand enhancement
3.6. Merchandising and increasing sales
3.6.1. Attracting attention
3.6.2. Rewards
3.7. Entertainment
3.7.1. Touchcode
3.8. Error Prevention
3.9. Environmental aspects of disposal
3.10. Environmental quality control within the package
3.11. Quality Assurance
3.12. Consumer feedback
3.13. Removing tedious procedures
3.14. Cost reduction, efficiency and automated data collection

4. THE MAGIC THAT IS BECOMING POSSIBLE
4.1. Printed electronics products from Toppan Forms
4.2. Solar bags
4.3. Smart substrates
4.4. Transparent and invisible electronics
4.5. Tightly rollable electronics
4.5.1. Fault tolerant electronics
4.6. Stretchable and morphing electronics
4.7. Edible electronics
4.8. Electronics as art
4.9. Origami electronics
4.10. The package becomes the delivery mechanism
4.11. Electronic release, dispensing and consumer information

5. BASIC HARDWARE PLATFORMS NEEDED BY THE MARKET
5.1. Winking image label
5.2. Talking label
5.3. Recording talking label
5.4. Scrolling text label
5.5. Timer
5.6. Self adjusting use by date
5.7. Other sensing electronics
5.8. Moving color picture label
5.9. Drug and cosmetic delivery system
5.10. Ultra low cost printed RFID/EAS label

6. PRECURSORS OF IMPENDING E-PACKAGING CAPABILITIES
6.1. Coming down market
6.2. T-Ink and all the senses

7. EXAMPLES OF E-PACKAGING
7.1. Examples of e-packaging and related uses with human interface
7.1.1. Printed electronics magazine cover - Blue Spark, NTERA, CalPoly, SiCal, Canvas and Ricoh
7.1.2. Printed electronic greeting cards - Tigerprint, PragmatIC, and Novalia
7.1.3. Cigarettes scrolling display - Kent
7.1.4. Talking pill compliance kit - MeadWestvaco
7.1.5. Monochrome reprogrammable phone decoration - Hitachi
7.1.6. Color reprogrammable phone decoration - Hewlett Packard and Kent Display
7.1.7. Rum winking segments - Coyopa
7.1.8. Talking pizza boxes - National Football League and Mangia Media
7.1.9. Batteries with integral battery tester - Duracell
7.1.10. Point of Sale Material - News Corporation and T-Ink
7.1.11. Place mats - McDonalds
7.1.12. Animation and sound - Westpoint Stevens
7.1.13. Board games become animated - Hasbro and Character Visions
7.1.14. Interactive tablecloth - Hallmark
7.1.15. Compliance monitoring blisterpack - National Institutes of Health/Fisher Scientific
7.1.16. Compliance monitoring blisterpack laminate - Novartis/Compliers Group/DCM
7.1.17. Smart blisterpack dispenser - Bang & Olufsen Medicom
7.1.18. Winking sign - ACREO
7.1.19. Compliance monitoring plastic bottle - Aardex
7.1.20. Talking medicine - CVS and other US pharmacies
7.1.21. Talking prizes - Coca-Cola
7.1.22. Beer package game - VTT Technology
7.1.23. Electronic cosmetic pack - Procter and Gamble
7.1.24. Cookie heater pack - T-Ink
7.1.25. Sata Airlines - Ynvisible
7.2. Examples of e-packaging without human interface
7.2.1. Time temperature label - Findus Bioett
7.2.2. Anti-theft - Wal-Mart/Tyco ADT
7.2.3. Time temperature recorders - Healthcare shippers/KSW Microtec
7.2.4. Fly seeking spray - Reckitt Benkiser
7.2.5. RFID for tracking - Tesco & Metro/Alien Technology
7.2.6. Blisterpack with electronic feedback buttons - Kuopio University Hospital
7.2.7. Trizivir - AstraZeneca
7.2.8. Oxycontin - Purdue Pharma
7.2.9. Viagra - Pfizer
7.2.10. Theft detection - Swedish Postal Service and Deutsche Post
7.2.11. Blood - Massachusetts General Hospital
7.2.12. Real time locating systems - Jackson Healthcare Hospitals/Awarepoint

8. THE TOOLKIT OF ELECTRONIC COMPONENTS FOR E-PACKAGING
8.1. Challenges of traditional components
8.2. Printed and potentially printed electronics
8.2.1. Successes so far
8.2.2. Materials employed
8.2.3. Printing technology employed
8.2.4. Multiple film then components printed on top of each other
8.3. Paper vs plastic substrates vs direct printing onto packaging
8.3.1. Paper vs plastic substrates
8.3.2. Electronic displays that can be printed on any surface
8.4. Transistors and memory inorganic
8.4.1. Nanosilicon ink
8.4.2. Zinc oxide based ink
8.5. Transistors and memory organic
8.6. Displays
8.6.1. Electrophoretic
8.6.2. Thermochromic
8.6.3. Electrochromic
8.6.4. Printed LCD
8.6.5. OLED
8.6.6. Electrowetting
8.7. Energy harvesting for packaging
8.7.1. Photovoltaics
8.7.2. Other
8.8. Batteries
8.8.1. Single use laminar batteries
8.8.2. Rechargeable laminar batteries
8.8.3. New shapes - laminar and flexible batteries
8.9. Transparent batteries and photovoltaics - NEC, Waseda University, AIST
8.10. Other important flexible components now available
8.10.1. Capacitors and supercapacitors
8.10.2. Applications for supercapacitors
8.10.3. Resistors
8.10.4. Conductive patterns for antennas, identification, keyboards etc.
8.10.5. Programming at manufacturer, purchaser or end user
8.11. New types of component - thin and flexible
8.11.1. Memristors
8.11.2. Metamaterials
8.11.3. Thin film lasers, supercabatteries, fuel cells

9. SUPPLIER AND DEVELOPER PROFILES
9.1. ACREO, Sweden
9.2. BASF, Germany
9.3. Blue Spark Technologies, USA
9.4. Canatu, Finland
9.5. CapXX, Australia
9.6. Cymbet, USA
9.7. E-Ink
9.8. Enfucell, Finland
9.9. Excellatron, USA
9.10. Fraunhofer Institute for Electronic Nano Systems (ENAS), Germany
9.11. Front Edge Technology, USA
9.12. Holst Centre, Netherlands
9.13. Infinite Power Solutions USA
9.14. Infratab, USA
9.15. Institute of Bioengineering and Nanotechnology (A*Star), Singapore
9.16. ISORG, France
9.17. Kovio, USA
9.18. Massachusetts Institute of Technology USA
9.19. MWV, USA
9.20. NEC, Japan
9.21. New University of Lisbon, Portugal
9.22. Novalia, UK
9.23. Plastic Logic, UK
9.24. PolyIC, Germany
9.25. PragmatIC Printing, UK
9.26. Printechnologics, Germany
9.27. PST Sensor, South Africa
9.28. Solarmer, USA
9.29. Soligie, USA
9.30. Thin Film Electronics, Norway
9.31. T-Ink
9.32. VTT, Finland

10. MARKET FORECASTS 2013-2023
10.1. How printed electronics is being applied
10.2. Surprisingly poor progress with low cost electronics so far
10.3. Ultimate market potential
10.4. E-packaging market 2013-2023
10.5. Beyond brand enhancement
10.6. Printed electronics market
10.7. Battery market for small devices
10.8. Printed electronics needs new design rules
10.9. The emerging value chain is unbalanced

APPENDIX 1: GLOSSARY
APPENDIX 2: IDTECHEX PUBLICATIONS AND CONSULTANCY

List of Tables

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List of Figures


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