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Semiconductor Production Equipment (SPE) Market in Southeast Asia 2017-2021

Published By :

Technavio

Published Date : Aug 2017

Category :

Semiconductors

No. of Pages : 90 Pages

About Semiconductor Production Equipment
The SPE market is divided into front-end and back-end process equipment industries. The front-end process includes the cutting-edge technology and integration. This process includes the silicon wafer process for manufacturing multiple integrated devices and the designing of electric circuits on the wafers. The back-end process involves chip assembling and the test process that includes dicing wafers and testing the chips. Semiconductor devices are used in mobile devices, including smartphones, tablets, data center servers that play a key role in the use of big data, and equipment made of semiconductor components. Furthermore, with the increasing applications of Internet of Things (IoT) globally, the demand for semiconductors will increase in various segments, including consumer electronics, automobile, and healthcare.

Technavios analysts forecast the semiconductor production equipment market in South East Asia to grow at a CAGR of 9.27% during the period 2017-2021.

Covered in this report
The report covers the present scenario and the growth prospects of the semiconductor production equipment market in South East Asia for 2017-2021. To calculate the market size, the report considers the shipment values and exclude replacements, spares, and the aftermarket services market.

The market is divided into the following segments based on geography:
Americas
APAC
EMEA

Technavio's report, Semiconductor Production Equipment Market in South East Asia 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
ASML,
Applied Materials,
Tokyo Electron,
KLA-Tencor,
Lam Research

Other prominent vendors
AIXTRON SE
ASM International
Veeco
Charm Engineering
DI
DMS
Eugene Technology
EXICON
From30
Global Standard Technology
Hanmi Semiconductor
Jusung Engineering
Kookje Electric Korea
Mirae
Mujin
NEONTECH
Nikon Instruments
Semes
SHINSUNG E&G
Teradyne
Market driver
Increasing applications of IoT
For a full, detailed list, view our report

Market challenge
Dependence on a limited number of suppliers
For a full, detailed list, view our report

Market trend
Increase in the use of semiconductor devices in automobiles
For a full, detailed list, view our report

Key questions answered in this report
What will the market size be in 2021 and what will the growth rate be?
What are the key market trends?
What is driving this market?
What are the challenges to market growth?
Who are the key vendors in this market space?
What are the market opportunities and threats faced by the key vendors?
What are the strengths and weaknesses of the key vendors?

You can request one free hour of our analysts time when you purchase this market report. Details are provided within the report.




Table of Contents
PART 01: Executive summary
PART 02: Scope of the report
PART 03: Research Methodology
PART 04: Introduction
Market outline
Industry overview
PART 05: Market landscape
Market overview
Market size and forecast
Five forces analysis
PART 06: Market segmentation by end-user
Market overview
Memory segment
Foundry segment
IDM segment
PART 07: Geographical segmentation
Market overview
Taiwan
South Korea
Japan
Rest of Southeast Asia
PART 08: Decision framework
PART 09: Drivers and challenges
Market drivers
Market challenges
PART 10: Market trends
PART 11: Vendor landscape
Competitive Scenario
Key vendors
Other prominent vendors
PART 12: Appendix
List of abbreviations
List of Exhibits
Exhibit 01: SPE market in Southeast Asia: Overview based on the manufacturing process
Exhibit 02: SPE market in Southeast Asia 2016
Exhibit 03: SPE market in Southeast Asia 2016-2021 ($ billions)
Exhibit 04: Five forces analysis
Exhibit 05: SPE market in Southeast Asia 2016-2021: Segmentation by end-user (% share of revenue)
Exhibit 06: SPE market in Southeast Asia 2016-2021: Segmentation by end-user ($ billions)
Exhibit 07: SPE market in Southeast Asia by memory segment 2016-2021 ($ billions)
Exhibit 08: SPE market in Southeast Asia by the foundry segment 2016-2021 ($ billions)
Exhibit 09: SPE market in Southeast Asia by the IDM segment 2016-2021 ($ billions)
Exhibit 10: SPE market in Southeast Asia: Geographical segmentation 2016-2021 (% share of revenue)
Exhibit 11: SPE market in Southeast Asia: Geographical segmentation 2016-2021 ($ billions)
Exhibit 12: SPE market in Taiwan 2016-2021 ($ billions)
Exhibit 13: SPE market in South Korea 2016-2021 ($ billions)
Exhibit 14: SPE market in Japan 2016-2021 ($ billions)
Exhibit 15: SPE market in rest of Southeast Asia 2016-2021 ($ billions)
Exhibit 16: Global NAND flash market 2015-2020 (% share of revenue)
Exhibit 17: CAGR of the LED chip, sensor, DRAM, and NAND markets 2015-2020
Exhibit 18: Growth of the global semiconductor market 1990-2016 ($ billions)
Exhibit 19: Car shipment growth rate 2015-2020 (% share)
Exhibit 20: Timeline for semiconductor wafer size developments
Exhibit 21: Key parameters of competition
Exhibit 22: SPE market in Southeast Asia: Market segmentation based on key vendors' penetration 2016 (% share of revenue)
Exhibit 23: R&D spending pattern of the key vendors 2014-2016 ($ millions)
Exhibit 24: Major SPE vendors: Ranking 2016
Exhibit 25: EPS pattern of the key vendors 2014-2016 ($)
Exhibit 26: Applied Materials: Revenue generated from semiconductor systems 2014-2016 ($ billions)
Exhibit 27: Applied Materials: Overall revenue segmentation 2016 (% share of revenue)
Exhibit 28: Applied Materials: R&D expenditure 2014-2016 ($ millions)
Exhibit 29: Applied Materials: Region wise segmentation of the revenue from SPE sales 2014-2016 (% share of revenue)
Exhibit 30: ASML: Revenue generated from semiconductor systems 2014-2016 ($ billions)
Exhibit 31: ASML: R&D expenditure 2014-2016 ($ millions)
Exhibit 32: ASML: Region wise segmentation of the revenue from SPE sales 2014-2016 (% share of revenue)
Exhibit 33: ASML: Global SPE sales 2016 (% share of revenue)
Exhibit 34: ASML: Global SPE sales based on the technology type 2015-2016 (% share of revenue)
Exhibit 35: KLA-Tencor: Products and services offered in the chip manufacturing market
Exhibit 36: KLA-Tencor: Products and services offered in the wafer manufacturing inspection tools market
Exhibit 37: KLA-Tencor: Products and services offered in the data storage media/head manufacturing market
Exhibit 38: KLA-Tencor: Products and services offered in the LED manufacturing market
Exhibit 39: KLA-Tencor: Products and services offered in the compound semiconductor manufacturing market
Exhibit 40: KLA-Tencor: Products and services offered in the MEMS manufacturing market
Exhibit 41: KLA-Tencor: Products and services offered in the surface profilometry and surface metrology market
Exhibit 42: KLA-Tencor: Revenue generated from semiconductor systems 2014-2016 ($ billions)
Exhibit 43: KLA-Tencor: R&D expenditure 2014-2016 ($ millions)
Exhibit 44: KLA-Tencor: Region wise segmentation of the revenue from SPE sales 2014-2016 (% share of revenue)
Exhibit 45: LAM Research: Product portfolio
Exhibit 46: LAM Research: Revenue generated from semiconductor systems 2014-2016 ($ billions)
Exhibit 47: LAM Research: R&D expenditure 2014-2016 ($ millions)
Exhibit 48: LAM Research: Region wise segmentation of the revenue from SPE sales 2014-2016 ((% share of revenue)
Exhibit 49: Tokyo Electron: Product portfolio
Exhibit 50: Tokyo Electron: Revenue contribution by clients 2016 (% share of revenue)
Exhibit 51: Tokyo Electron: Region wise segmentation of the revenue from SPE sales 2015 and 2016 ((% share of revenue)
Exhibit 52: Tokyo Electron: R&D expenditure 2014-2016 ($ millions)
Exhibit 53: Other prominent vendors

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