BIPV Encapsulation Markets – 2012
Published Date » 2012-05-15
No. Of Pages » N/A
As the subsidies that have supported the solar industry for years come into question or disappear altogether, the industry is looking around for new business models. One possible direction for solar is towards building-integrated photovoltaics (BIPV), where the cost model is superior to regular PV. BIPV holds out the hope that the PV industry can flourish with fewer subsidies.
As things turn out, this opportunity for the PV, will also be a growing opportunity for the encapsulation business too. Flexibility is often required in BIPV and this means that manufacturers of BIPV often have an immediate need for an effective flexible PV encapsulation system. In addition, as monolithic integration becomes more common, specialist encapsulation systems are required to protect the relatively delicate CIGS, OPV and DSC absorber materials that are commonly used in such products.
This report identifies and quantifies the emerging market for encapsulation systems and materials in the BIPV market. It investigates both how the leading suppliers of encapsulation products are viewing BIPV as a market for their products and the current and future demand for encapsulation from the BIPV industry itself. This NanoMarkets report includes a granular eight-year forecast of the BIPV encapsulation markets and assessments of the leading product/market strategies being adopted in this business.
TABLE OF CONTENTS
E.1 What opportunities remain for rigid BIPV encapsulation?
E.2 What changes in demand for flexible BIPV encapsulation will occur in the next five years?
E.3 Future trends and opportunities in BIPV glass encapsulation?
E.4 Niche opportunities for encapsulating CIGS, OPV and DSC BIPV products
E.5 Key firms to watch
E.6 Reducing costs and creating value in BIPV with encapsulation technology
E.4 Summary of eight-year forecasts of encapsulant materials
Chapter One: Introduction
1.1 Background to this report
1.2 Objectives and scope of this Report
1.3 Methodology of this report
1.4 Plan of this Report
Chapter Two: Current and Evolving Encapsulation Technologies for BIPV Markets
2.1 Alternatives to glass encapsulation: metal and polymers
2.1.1 Polymer films: how costs can come down
2.1.2 Metal options: steel and aluminum
2.1.3 Ceramic films: advantages and disadvantages
2.2 Flexible encapsulants for BIPV
2.3 The dyad option: best of both worlds, but at what cost?
2.4 The special needs of CIGS BIPV
2.4.1 CIGS in BIP
2.4.2 Current and future encapsulation trends in CIGS BIPV
2.5 The special needs of OPV/DSC BIPV
2.5.1 OPV/DSC in BIPV
2.5.2 Current and future encapsulation trends in OPV/DSC BIPV
2.6 Key points made in this Chapter
Chapter Three Opportunities for BIPV Encapsulation and Substrate Materials
3.1 The limits of glass encapsulation for BIPV
3.1.1 Changing requirements for rigid BIPV encapsulation
3.1.2 Changing requirements for flexible BIPV encapsulation
3.1.3 Changing requirements for BIPV glass encapsulation
3.2 New opportunities for glass in BIPV encapsulation
3.2.1 Opportunities for flexible glass in BIPV
3.2.2 The need for other specialized glasses in BIPV
3.2 The future of plastic film and other advanced encapsulation systems in BIPV
3.3 Encapsulation of BIPV on sheet steel and aluminum
3.4 Encapsulation of BIPV on other roofing and siding materials
3.5 A roadmap for encapsulation in BIPV
3.6 Key points made in this chapter
Chapter Four: Eight-Year Forecasts of Encapsulation and Substrate Markets for Thin-Film Photovoltaics
4.1 Forecasting methodology
4.1.1 Information sources
4.1.2 Scope of forecast
4.2 Forecasts of rigid BIPV encapsulation
4.2.1 Forecast by type of substrate
4.2.2 Forecast by type of PV material
4.2.3 Forecast by type of encapsulation technology/material
4.3 Forecasts of flexible BIPV encapsulation
4.3.1 Forecast by type of substrate
4.3.2 Forecast by type of PV material
4.3.3 Forecast by type of encapsulation technology/material
4.4 Forecasts of BIPV glass encapsulation
4.4.1 Forecast by type of substrate
4.4.2 Forecast by type of PV material
4.4.3 Forecast by type of encapsulation technology/material
4.5 Summary of forecasts
List of TablesNA
List of FiguresNA
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